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1. JP2009540613 - 複数レベルのロードロックチャンバ、移送チャンバ、及びこれにインターフェイスするのに適したロボット

Office Japan
Application Number 2009515565
Application Date 04.06.2007
Publication Number 2009540613
Publication Date 19.11.2009
Publication Kind A5
IPC
H01L 21/677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
677for conveying, e.g. between different work stations
CPC
H01L 21/67742
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67739into and out of processing chamber
67742Mechanical parts of transfer devices
H01L 21/67201
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67201characterized by the construction of the load-lock chamber
Y10S 414/135
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
414Material or article handling
135Associated with semiconductor wafer handling
Y10T 29/49826
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49826Assembling or joining
Applicants アプライド マテリアルズ インコーポレイテッド
Inventors ムーア, ロバート ビー.
ルーランド, エリック
サンダー, サティッシュ
シルヴェッティ, マリオ デイヴィッド
Agents 園田 吉隆
小林 義教
Priority Data 11/424,461 15.06.2006 US
Title
(JA) 複数レベルのロードロックチャンバ、移送チャンバ、及びこれにインターフェイスするのに適したロボット
Abstract
(JA)

基板を処理するための新規な装置が開示される。4つの環境的に分離されたチャンバを有する複数レベルのロードロックチャンバが、ロボットアッセンブリを有する移送チャンバとインターフェイスする。ロボットアッセンブリは、ロボットアッセンブリがその軸の周りで回転するときに水平方向に各々移動できる2つのアームを有する。これらのアームは、ロードロックの分離されたチャンバに届き、底部の分離されたチャンバから基板を受け入れ、基板をプロセスチャンバへ搬送し、次いで、基板を上部チャンバへ入れることができる。ロードロックチャンバにおける分離されたチャンバは、分離されたチャンバの内部にアクセスするために開くことのできる枢着された蓋を含むことができる。
【選択図】 図2

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