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1. JP2009527877 - パワー半導体モジュールの短絡装置

Office
Japan
Application Number 2008555602
Application Date 23.02.2006
Publication Number 2009527877
Publication Date 30.07.2009
Publication Kind A5
IPC
H01H 39/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
39Switching devices actuated by an explosion produced within the device and initiated by an electric current
H02H 7/12
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
HEMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
7Emergency protective circuit arrangements specially adapted for specific types of electric machines or apparatus or for sectionalised protection of cable or line systems, and effecting automatic switching in the event of an undesired change from normal working conditions
10for converters; for rectifiers
12for static converters or rectifiers
CPC
H01H 39/004
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
39Switching devices actuated by an explosion produced within the device and initiated by an electric current
004Closing switches
H01H 79/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
79Protective switches in which excess current causes the closing of contacts, e.g. for short-circuiting the apparatus to be protected
H01L 23/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
62Protection against overvoltage, e.g. fuses, shunts
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/3011
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
30Technical effects
301Electrical effects
3011Impedance
H02M 7/4835
Applicants シーメンス アクチエンゲゼルシヤフト
Inventors ドンマシュク、ミケ
ドルン、イェルク
ホルヴェーク、ヨハン
ラング、イェルク
プライデル、アクセル
ヴュルフリンガー、クラウス
Agents 山口 巖
山本 浩
Title
(JA) パワー半導体モジュールの短絡装置
Abstract
(JA)

接続手段を介して直列回路構成にて互いに接続されたパワー半導体モジュールを備え、各パワー半導体に、それぞれのパワー半導体モジュールを短絡するための短絡装置が付設されている装置であって、高信頼性かつ同時に低コストの短絡装置を有する装置を提供するために、短絡装置が、起爆装置と起爆装置によって移動可能な作動手段(9)とを有する火工技術的機械要素(1)であることを特徴とする。