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1. JP2009527076 - 導電線パターン形成のための銀オルガノゾルインク

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Office
Japan
Application Number 2008554124
Application Date 11.01.2007
Publication Number 2009527076
Publication Date 23.07.2009
Publication Kind A5
IPC
H01B 1/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
C09D 11/00
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
CPC
C09D 11/30
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
30Inkjet printing inks
C09D 11/52
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
11Inks
52Electrically conductive inks
E02B 3/124
EFIXED CONSTRUCTIONS
02HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
BHYDRAULIC ENGINEERING
3Engineering works in connection with control or use of streams, rivers, coasts, or other marine sites
04Structures or apparatus for, or methods of, protecting banks, coasts, or harbours
12Revetment of banks, dams, watercourses, or the like, ; e.g. the sea-floor
122Flexible prefabricated covering elements, e.g. mats, strips
124mainly consisting of metal
E02D 29/0208
EFIXED CONSTRUCTIONS
02HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
DFOUNDATIONS; EXCAVATIONS; EMBANKMENTS
29Independent; underground or underwater structures
02Retaining or protecting walls
0208Gabions
E02D 2200/165
EFIXED CONSTRUCTIONS
02HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
DFOUNDATIONS; EXCAVATIONS; EMBANKMENTS
2200Geometrical or physical properties
16Shapes
165polygonal
E02D 2300/0034
EFIXED CONSTRUCTIONS
02HYDRAULIC ENGINEERING; FOUNDATIONS; SOIL SHIFTING
DFOUNDATIONS; EXCAVATIONS; EMBANKMENTS
2300Materials
0026Metals
0029Steel; Iron
0034in wire form
Applicants エマックス，インコーポレイテッド
Inventors ヘオ，スーン　ヨン
セオ，ドン　スン
リー，エウン　ジ
ハン，セウン　ジュン
キム，クワン　セオプ
ジャン，ヒュン　ミュン
Agents ▲吉▼川　俊雄
Priority Data 1020060013535 13.02.2006 KR
Title
(JA) 導電線パターン形成のための銀オルガノゾルインク
Abstract
(JA)

本発明は導電線パターン形成のための溶液型銀オルガノゾルインクに係り、炭素数
０〜１６であって１〜３のカルボキシル基を有し、アミノ基、ニトロ基、ヒドロキシ
基に置換されたり置換されない直鎖有機溶媒で構成される導電線パターン形成のため
の溶液性銀オルガノゾルインクが提供される。
本発明によって多様な還元または金属化温度を有して銀含量が高い溶液型銀オルガ
ノゾルインクが得られる。このような溶液状態のインクは既存のインクジェットプリ
ンティングによってＰＤＰ（プラズマディスプレイパネル）のような平板ディスプレ
イの導電線パターン形成に用いられてこれらの生産工程を画期的に減らすことができ
る。特に本発明の金属化された銀オルガノゾルインクは熱硬化性樹脂のような柔軟基
板に比較的低温で導電性パターンを形成するのに用いられることができる。
【選択図】図１１
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