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1. JPWO2008065799 - 熱発電素子を用いた発電方法、熱発電素子とその製造方法、ならびに熱発電デバイス

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Japan
Application Number 2008504559
Application Date 19.09.2007
Publication Number WO2008065799
Publication Date 05.06.2008
Grant Number 4124807
Grant Date 16.05.2008
Publication Kind A1
IPC
H01L 35/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device
H01L 35/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
14using inorganic compositions
16comprising tellurium or selenium or sulfur
H01L 35/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
34Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
H02N 11/00
HELECTRICITY
02GENERATION, CONVERSION, OR DISTRIBUTION OF ELECTRIC POWER
NELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
11Generators or motors not provided for elsewhere; Alleged perpetua mobilia obtained by electric or magnetic means
CPC
H01L 35/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
14using inorganic compositions
16comprising tellurium or selenium or sulfur
H01L 35/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device ; including details about, e.g., housing, insulation, geometry, module
H01L 35/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
34Processes or apparatus specially adapted for peculiar to the manufacture or treatment of these devices or of parts thereof
Y10T 156/1062
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
156Adhesive bonding and miscellaneous chemical manufacture
10Methods of surface bonding and/or assembly therefor
1052with cutting, punching, tearing or severing
1062Prior to assembly
Applicants パナソニック株式会社
Inventors 菅野　勉
足立　秀明
四橋　聡史
Agents 鎌田　耕一
Priority Data 2006323381 30.11.2006 JP
Title
(JA) 熱発電素子を用いた発電方法、熱発電素子とその製造方法、ならびに熱発電デバイス
Abstract
(JA)

従来よりも高い熱発電性能を有し、より多くの用途への応用が可能となる、熱発電素子を用いた発電方法、熱発電素子および熱発電デバイスを提供する。互いに対向して配置された第１の電極および第２の電極と、第１および第２の電極に狭持され、かつ第１および第２の電極の双方に電気的に接続された積層体とを備え、積層体はＢｉ2Ｔｅ3層と、Ａｌ、Ｃｕ、ＡｇまたはＡｕを含む金属層とが交互に積層された構造を有し、金属層とＢｉ2Ｔｅ3層との厚さの比が、金属層：Ｂｉ2Ｔｅ3層＝４００：１〜２０：１の範囲にあり、Ｂｉ2Ｔｅ3層および金属層の積層面は、第１の電極と第２の電極とが対向する方向に対して、１５°以上６０°以下の傾斜角θで傾斜しており、素子における上記方向に垂直な方向の温度差により、第１および第２の電極間に電位差が発生する熱発電素子、ならびに当該素子を用いた発電方法および熱発電デバイスとする。
【選択図】図１
Related patent documents
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