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1. JP2006128368 - SUBSTRATE PROCESSOR AND SUBSTRATE ROTATION DEVICE

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Office
Japan
Application Number 2004313919
Application Date 28.10.2004
Publication Number 2006128368
Publication Date 18.05.2006
Publication Kind A
IPC
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
68for positioning, orientation or alignment
CPC
H01L 21/67109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
67109mainly by convection
H01L 21/68792
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68792characterised by the construction of the shaft
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
Applicants TOKYO ELECTRON LTD
東京エレクトロン株式会社
Inventors TANAKA KIYOSHI
田中　澄
SUZUKI KIMITAKA
鈴木　公貴
Agents 高山　宏志
Title
(EN) SUBSTRATE PROCESSOR AND SUBSTRATE ROTATION DEVICE
(JA) 基板処理装置、および基板回転装置
front page image
Abstract
(EN)

PROBLEM TO BE SOLVED: To reduce particles in a substrate processor provided with a rotation mechanism.

SOLUTION: The substrate processor is provided with a processing container 1 dividing a processing space for processing a substrate to be processed W, a substrate supporting body 12 supporting the substrate to be processed W in the processing container, a movable member 11 which is directly or indirectly connected to the substrate supporting body 12, and a rotor 10 rotating the substrate supporting body 12 through the movable member 11 by rotation while it abuts on the movable member 11. The movable member 11 and the rotor 10 are formed of ceramic materials whose values of fracture toughness defined in JIS R1607, and/or whose values of three point flexural strength defined in JIS R1601 differ.

COPYRIGHT: (C)2006,JPO&NCIPI


(JA)

【課題】回転機構を備えた基板処理装置において、パーティクルの低減を図る。
【解決手段】基板処理装置は、被処理基板Ｗを処理するための処理空間を区画する処理容器１と、処理容器内において被処理基板Ｗを支持する基板支持体１２と、基板支持体１２に直接もしくは間接的に連結された可動部材１１と、可動部材１１に当接しつつ回転することにより、該可動部材１１を介して基板支持体１２を回転させる回転体１０と、を備えており、可動部材１１と回転体１０は、ＪＩＳ Ｒ１６０７に規定する破壊靱性の値および／またはＪＩＳ Ｒ１６０１に規定する３点曲げ強度の値が異なるセラミックス材料により構成される。
【選択図】図１
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