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1. JP2001512902 - 基板乾燥のための方法および装置

Office
Japan
Application Number 2000506492
Application Date 05.08.1998
Publication Number 2001512902
Publication Date 28.08.2001
Publication Kind A
IPC
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
F26B 5/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
5Drying solid materials or objects by processes not involving the application of heat
F26B 9/06
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
9Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
06in stationary drums or chambers
F26B 21/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
21Arrangements for supplying or controlling air or gases for drying solid materials or objects
CPC
H01L 21/67034
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
67034for drying
H01L 21/68728
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68728characterised by a plurality of separate clamping members, e.g. clamping fingers
Y10S 134/902
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
134Cleaning and liquid contact with solids
902Semiconductor wafer
Applicants アプライド マテリアルズ インコーポレイテッド
Inventors フィッシュキン, ボリス
ハーン, ジョン, エス.
ローレンス, ロバート, ビ-.
Agents 長谷川 芳樹
山田 行一
沖本 一暁
池田 成人
Priority Data 08908245 07.08.1997 US
Title
(JA) 基板乾燥のための方法および装置