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1. JP1998504062 - 銀パラジウム合金

Office Japan
Application Number 1996507396
Application Date 31.07.1995
Publication Number 1998504062
Publication Date 14.04.1998
Grant Number 3574139
Grant Date 09.07.2004
Publication Kind B2
IPC
C22C 5/06
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
H01H 1/02
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1Contacts
02characterised by the material thereof
CPC
C22C 30/02
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
30Alloys containing less than 50% by weight of each constituent
02containing copper
C22C 5/06
CCHEMISTRY; METALLURGY
22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
CALLOYS
5Alloys based on noble metals
06Alloys based on silver
Applicants
Inventors クライン,アーサー エス.
スミス,エドード エフ.,ザ サード
Agents 浅村 皓
浅村 肇
吉田 裕
岩本 行夫
Priority Data 08/289,509 12.08.1994 US
Title
(JA) 銀パラジウム合金
Abstract
Also published as