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1. (JP2011009786) MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

Office : Japan
Application Number: 2010228964 Application Date: 08.10.2010
Publication Number: 2011009786 Publication Date: 13.01.2011
Publication Kind : A
IPC:
H05K 3/46
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
Applicants: MURATA MFG CO LTD
株式会社村田製作所
Inventors: OIKAWA YOSHIKAZU
及川 善和
YOSHIKAWA TAKAYOSHI
吉川 孝義
Agents: 小原 肇
Priority Data: 2005203443 12.07.2005 JP
Title: (EN) MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
(JA) 多層配線基板及びその製造方法
Abstract:
(EN) PROBLEM TO BE SOLVED: To provide a multilayer wiring board that improves the connection reliability of a wiring pattern between layers while increasing the wiring pattern density according to the pitch narrowing of the connection terminal of an integrated circuit.

SOLUTION: The multilayer wiring board 10 includes a stack 11 formed by stacking a plurality of ceramic layers 11A, and a wiring pattern 12 disposed in the stack 11. As a wiring pattern 12, the ceramic layer 11A has a through via hole conductor 17 passing vertically through the ceramic layer 11A and a semi through continuous via hole conductor 17A electrically connected to the through via hole conductor 17 in the same ceramic layer 11A while does not passing through the ceramic layer 11A. The width of the semi through continuous via hole 17A is formed narrower than that of the through via hole conductor 17.

COPYRIGHT: (C)2011,JPO&INPIT
(JA)

【課題】集積回路の接続用端子の狭ピッチ化等に対応させて配線パターンを高密度化することができると共に層間の配線パターンの接続信頼性を高めることができる多層配線基板を提供する。
【解決手段】本発明の多層配線基板10は、複数のセラミック層11Aを積層してなる積層体11と、積層体11内に設けられた配線パターン12と、を備え、セラミック層11Aには、配線パターン12として、セラミック層11Aを上下に貫通する貫通ビアホール導体17と、貫通ビアホール導体17に同一セラミック層11A内で電気的に接続され、このセラミック層11Aを貫通しない半貫通連続ビアホール導体17Aと、を有し、半貫通連続ビアホール導体17Aの幅が貫通ビアホール導体17の幅より狭く形成されている。
【選択図】図2


Also published as:
JPWO2007007451US20080093117JP4748161CN101213890WO/2007/007451