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1. (JP2010016367) LIGHT EMITTING DIODE ELEMENT, AND BACKLIGHT MODULE

Office : Japan
Application Number: 2009138854 Application Date: 10.06.2009
Publication Number: 2010016367 Publication Date: 21.01.2010
Publication Kind : A
IPC:
F21Y 101/02
F21S 2/00
H01L 33/54
F21V 3/00
F21V 19/00
G02B 6/00
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
Y
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21L, F21S and F21V104
101
Point-like light sources
02
Miniature, e.g. light emitting diodes (LED)
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
S
NON-PORTABLE LIGHTING DEVICES OR SYSTEMS THEREOF
2
Systems of lighting devices, not provided for in main groups F21S4/-F21S10/119
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33
Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48
characterised by the semiconductor body packages
52
Encapsulations
54
having a particular shape
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
3
Globes; Bowls; Cover glasses
F MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21
LIGHTING
V
FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19
Fastening of light sources or lamp holders
G PHYSICS
02
OPTICS
B
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6
Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
CPC:
H01L 33/54
G02B 6/0021
G02B 6/0023
G02B 6/003
Applicants: ADVANCED OPTOELECTRONIC TECHNOLOGY INC
先進開發光電股▲ふん▼有限公司
Inventors: TSANG JIAN SHIHN
曾 監信
CHEN IRENE
陳 怡▲ジョウ▼
Agents: 磯兼 智生
Priority Data: 097125501 07.07.2008 TW
Title: (EN) LIGHT EMITTING DIODE ELEMENT, AND BACKLIGHT MODULE
(JA) 発光ダイオード素子及びバックライトモジュール
Abstract: front page image
(EN) PROBLEM TO BE SOLVED: To provide a light emitting diode element and a backlight module such that light is uniformly diffused over a wide angle and concentrated, the amount of light input to a light guiding plate in the backlight module increases, and large non-uniformity of light and shade at a light entrance side of the light guiding plate can be eliminated.

SOLUTION: The light emitting diode element includes a substrate, an light emitting diode chip and an encapsulation resin body. The light emitting diode chip is fixed on a surface of the substrate, and the encapsulation resin body is overlaid on the light emitting diode chip and the substrate. The encapsulation body includes a light output surface. The light output surface can uniformly diffuse light emitted by the light emitting diode chip over a wide angle and concentrate the emission light in two mutually perpendicular directions parallel to the substrate surface.

COPYRIGHT: (C)2010,JPO&INPIT
(JA)

【課題】 広角に光線を均一化する効果と光線を集中させる効果を有し、また、バックライトモジュール内の導光板の光入力量も増加し、導光板の光入力側に顕著な明暗の不均一が生じないようにできる、発光ダイオード素子及びバックライトモジュールの提供。
【解決手段】 本発明の発光ダイオード素子は、基板、発光ダイオードチップ、パッケージ樹脂体を含む。前記発光ダイオードチップは前記基板の表面に固定され、前記パッケージ樹脂体が前記発光ダイオードチップと前記基板上を覆う。前記パッケージ樹脂体は光出力面を備え、そのうち、前記光出力面は前記基板表面に平行かつ2つの相互に垂直の方向上においてそれぞれ前記発光ダイオードチップが射出する光線を広角で均一にし、集中して射出させる。
【選択図】 図3B


Also published as:
US20100002465