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1. (JP2007536752) 遮蔽電子装置およびその製造方法

Office : Japan
Application Number: 2007511981 Application Date: 27.04.2005
Publication Number: 2007536752 Publication Date: 13.12.2007
Publication Kind : A
IPC:
H01L 23/00
H05K 9/00
G06K 19/077
H01F 27/36
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9
Screening of apparatus or components against electric or magnetic fields
G PHYSICS
06
COMPUTING; CALCULATING; COUNTING
K
RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19
Record carriers for use with machines and with at least a part designed to carry digital markings
06
characterised by the kind of the digital marking, e.g. shape, nature, code
067
Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07
with integrated circuit chips
077
Constructional details, e.g. mounting of circuits in the carrier
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
F
MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27
Details of transformers or inductances, in general
34
Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
36
Electric or magnetic shields or screens
CPC:
G06K 19/07735
G06K 19/07743
H01L 23/49855
H01L 23/552
H01L 24/45
H01L 24/48
H01L2224/32014
H01L2224/32225
H01L2224/45144
H01L2224/48091
H01L2224/48463
H01L2224/73265
H01L2924/00014
H01L2924/01013
H01L2924/01019
H01L2924/0102
H01L2924/01057
H01L2924/01077
H01L2924/01079
H01L2924/14
H01L2924/16152
H01L2924/3025
Applicants: コミサリア、ア、レネルジ、アトミク
COMMISSARIAT A L’ENERGIE ATOMIQUE
Inventors: パンティエ,ミリアム
フェルモン,クロード
ボンヴァロ,ベアトリス
Agents: 酒井 宏明
Priority Data: 04291122 03.05.2004 EP
Title: (JA) 遮蔽電子装置およびその製造方法
Abstract: front page image
(JA)

【課題】保護すべき電子組立部品を有し、扁平な携帯用製品に組み込まれる電子装置の無線高周波の放出を不正な者が検出することを防ぐ。
【解決手段】保護すべき少なくとも一つの組立電子部品(1)の上面(11)と下面(12)の少なくとも一つ(11)と、前記組立電子部品(1)から放出する電磁(EM)および/または高周波(RF)電界に対抗する少なくとも一つの遮蔽層(20、120)とを有し、前記遮蔽層(20,120)が500を超える大きさの高い非透磁率μrを有する軟磁性材料からなる少なくとも一つの第1の層(21、121)を有し、前記遮蔽層(120)が機械的研磨や化学的腐食に良好な耐性を示す機械的硬質層である追加の外層(124)をさらに有し、前記遮蔽層(20,120)が、前記上面(11)および下面(12)の少なくとも一つ(11)の、外部装置と接続する前記電気接続端子を設けるための予め設定された領域(1a、23,123)を除いたほぼ全表面上に設けられている。
【選択図】 図1


Also published as:
KR1020070055419EP1745509US20110068441CN1977380WO/2005/106953