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1. IN7699/CHENP/2014 - HOT MELT ADHESIVE

Office
India
Application Number 7699/CHENP/2014
Application Date 20.10.2014
Publication Number 7699/CHENP/2014
Publication Date 01.07.2016
Publication Kind A
IPC
C09J 10/00
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
11Features of adhesives not provided for in group C09J9/76
02Non-macromolecular additives
06organic
C09J 15/00
Applicants HENKEL AG & CO. KGaA
Inventors TAKENAKA Makoto
Priority Data 2012101888 26.04.2012 JP
Title
(EN) HOT MELT ADHESIVE
Abstract
(EN) The present invention provides a hot melt adhesive being highly environmentally friendly and as well having sufficient tackiness adhesion thermal stability and the like. The present invention relates to a hot melt adhesive comprising (A) a polar functional group modified conjugated diene based polymer (B) an aliphatic polyester based resin and (C) a tackifier resin.