Processing

Please wait...

Settings

Settings

Goto Application

1. IN8914/DELNP/2011 - LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITION

Office India
Application Number 8914/DELNP/2011
Application Date 15.11.2011
Publication Number 8914/DELNP/2011
Publication Date 21.12.2012
Publication Kind A
IPC
B23B
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
BTURNING; BORING
Applicants HARIMA CHEMICALS  INC.
Inventors Yoji IMAMURA
Kazuki IKEDA
JinYu PIAO
Tadashi TAKEMOTO
Priority Data 2010-242916 29.10.2010 JP
Title
(EN) LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITION
Abstract
(EN)
A low silver solder alloy of the present invention comprises 0.05-2.0% by mass of silver; 1.0% by mass or less of copper; 3.0% by mass or less of antimony; 2.0% by mass or less of bismuth; 4.0% by mass or less of indium; 0.2% by mass or less of nickel; 0.1% by mass or less of germanium; 0.5% by mass or less of cobalt (provided that none of the copper  the antimony  the bismuth  the indium  the nickel  the germanium  and the cobalt is 0% by mass); and the residue is tin. According to the present invention 

Also published as
MXMX/a/2011/011353