PATENTSCOPE will be unavailable a few hours for maintenance reason on Tuesday 19.11.2019 at 4:00 PM CET
Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (IN488/KOLNP/2008) THERMOSETTING SOLVENT-FREE SINGLE-COMPONENT COMPOSITIONS AND THEIR USE

Office : India
Application Number: 488/KOLNP/2008 Application Date: 04.02.2008
Publication Number: 488/KOLNP/2008 Publication Date: 17.10.2008
Grant Number: 249847 Grant Date: 18.11.2011
Publication Kind : B
Prior PCT appl.: Application Number:PCTEP2006006447 ; Publication Number:WO2007003392 Click to see the data
IPC:
C09J 17/02
[IPC code unknown for C09J 17/02]
Applicants: DELO INDUSTRIEKLEBSTOFFE GMBH & CO. KG
Inventors: MICHAEL STUMBECK
JUERGEN KOEBLER
Priority Data: 10 2005 031 381.7 05.07.2005 DE
Title: (EN) THERMOSETTING SOLVENT-FREE SINGLE-COMPONENT COMPOSITIONS AND THEIR USE
Abstract:
(EN) We propose a thermosetting solvent-free single-component compositionhaving a storage stability at room temperature of at least 2 weeks, consisting of(A) 5-90 parts by weight of one at least difunctional (iso)cyanate component,(B) 5-50 parts by weight of a latent curing agent solid up to a temperature ofat least 40 °C based on nitrogen compounds suitable for addition crosslinking,(C) 0-50 parts by weight of an epoxy-containing compound and(D) 0-50 parts by weight of modifiers,with the sum of all parts by weight being 100, and its use for bonding, casting,sealing and coating of substrates, in particular electronic parts. The compositionis cured at 120 °C to 150 °C within seconds.
Also published as:
EP1899431US20100212830CN101253249WO/2007/003392