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1. IN1177/CHENP/2008 - A METHOD OF MANUFACTURING A MICROSYSTEM, SUCH A MICROSYSTEM, A STACK OF FOILS COMPRISING SUCH A MICROSYSTEM, AN ELECTRONIC DEVICE COMPRISING SUCH A MICROSYSTEM AND USE OF THE ELECTRONIC DEVICE

Office
India
Application Number 1177/CHENP/2008
Application Date 07.03.2008
Publication Number 1177/CHENP/2008
Publication Date 12.09.2008
Publication Kind A
IPC
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
Applicants KONINKLIJKE PHILIPS ELECTORNICS N.V.
Inventors LANGEREIS, GEERT
WEEKAMP, JOHANNES, WILHELMUS
GIESBERS, JACOBUS, BERNARDUS
Priority Data 05108276.6 09.09.2005 EP
Title
(EN) A METHOD OF MANUFACTURING A MICROSYSTEM, SUCH A MICROSYSTEM, A STACK OF FOILS COMPRISING SUCH A MICROSYSTEM, AN ELECTRONIC DEVICE COMPRISING SUCH A MICROSYSTEM AND USE OF THE ELECTRONIC DEVICE
Abstract
(EN) The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (1 lA lb) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the Microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various Microsystems, like MEMS devices and microfluidic systems.