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1. EP2455435 - ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME

Office European Patent Office
Application Number 10799959
Application Date 27.01.2010
Publication Number 2455435
Publication Date 23.05.2012
Publication Kind A1
IPC
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 5/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
02involving pretreatment of the surfaces to be joined
CPC
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C08K 7/16
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
7Use of ingredients characterised by shape
16Solid spheres
C09J 5/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
06involving heating of the applied adhesive
C09J 11/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
08Macromolecular additives
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
C09J 2205/31
Applicants KOREA ADVANCED INST SCI & TECH
Inventors PAIK KYUNG-WOOK
LEE KIWON
KIM SEUNG HO
Title
(DE) ANISOTROPES LEITFÄHIGES HAFTMITTEL FÜR ULTRASCHALLWELLENHAFTUNG UND VERFAHREN ZUR VERBINDUNG ELEKTRONISCHER TEILE DAMIT
(EN) ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME
(FR) ADHÉSIF CONDUCTEUR ANISOTROPE POUR ADHÉSION D ONDES ULTRASONORES, ET PROCÉDÉ DE CONNEXION DE PARTIES ÉLECTRONIQUES UTILISANT LEDIT ADHÉSIF
Abstract
(EN)
The present invention is to provide an anisotropic conductive adhesive (ACA) for ultrasonic wave adhesion, which electrically connects a first electrode, which is an electrode of a connection portion of a first electronic component, with a second electrode, which is an electrode of a connection portion of a second electronic component. The anisotropic conductive adhesive includes an insulating polymer resin, conductive adhesive particles which are melted by heat generated from the ultrasonic waves applied to the anisotropic conductive adhesive, and spacer particles, which have a melting point higher than that of the adhesive particles, and wherein the adhesive particles are melted and made to come in surface contact with at least one electrode selected from the first electrode and the second electrodes, and the first electrode and the second electrode are electrically connected with a constant gap maintained between the first electrode and the second electrode by the spacer particles.

(FR)
L'invention concerne un adhésif conducteur anisotrope (ACA) connectant électriquement une première électrode qui est une électrode d'une partie de connexion d'une première partie électronique et une seconde électrode qui est une électrode d'une partie de connexion d'une seconde partie électronique. L'adhésif conducteur anisotrope pour adhésion d'ondes ultrasonores de l'invention comprend une résine polymère isolante ; des particules adhésives conductrices qui sont fondues par la chaleur générée par les ondes ultrasonores appliquées par l'adhésif conducteur anisotrope ; et des particules d'espacement qui présentent un point de fusion supérieur à celui des particules adhésives. Lesdites particules adhésives sont fondues de façon à venir en contact de surface avec au moins une électrode sélectionnée à partir de la première et de la seconde électrode, la première et de la seconde électrode étant connectées électriquement à un espace maintenu constant entre elles par les particules d'espacement.

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