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1. (EP2376587) SLURRY COMPOSITION CONTAINING NON-IONIC POLYMER AND METHOD FOR USE

Office : European Patent Office
Application Number: 09837913 Application Date: 17.12.2009
Publication Number: 2376587 Publication Date: 19.10.2011
Publication Kind : A4
Designated States: AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR
Prior PCT appl.: Application Number:US2009068466 ; Publication Number: Click to see the data
IPC:
C09K 3/14
B28D 1/08
B28D 5/00
H01L 21/304
C CHEMISTRY; METALLURGY
09
DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
K
MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
3
Materials not provided for elsewhere
14
Anti-slip materials; Abrasives
B PERFORMING OPERATIONS; TRANSPORTING
28
WORKING CEMENT, CLAY, OR STONE
D
WORKING STONE OR STONE-LIKE MATERIALS
1
Working stone or stone-like materials, e.g. brick, concrete, not provided for elsewhere; Machines, devices, tools therefor
02
by sawing
08
with saw blades of endless cutter-type, e.g. chain saws, strap saws
B PERFORMING OPERATIONS; TRANSPORTING
28
WORKING CEMENT, CLAY, OR STONE
D
WORKING STONE OR STONE-LIKE MATERIALS
5
Fine working of gems, jewels, crystals, e.g. of semiconductor material; Apparatus therefor
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304
Mechanical treatment, e.g. grinding, polishing, cutting
CPC:
B28D 5/007
B28D 1/08
C09K 3/1463
C10M 125/08
C10M 173/02
C10M 2201/061
C10M 2201/10
C10M 2209/04
C10M 2209/12
C10M 2217/028
C10N 2240/401
Y02P 70/179
Applicants: CABOT MICROELECTRONICS CORP
Inventors: GRUMBINE STEVEN
NAM CHUL-WOO
WARD WILLIAM
NAGARAJAN RAMASUBRAMANYAM
Priority Data: 2009068466 17.12.2009 US
31725408 19.12.2008 US
Title: (DE) AUFSCHLÄMMUNG MIT NICHTIONISCHEM POLYMER UND VERWENDUNG
(EN) SLURRY COMPOSITION CONTAINING NON-IONIC POLYMER AND METHOD FOR USE
(FR) COMPOSITION DE BOUILLIE CONTENANT UN POLYMÈRE NON IONIQUE ET SON PROCÉDÉ D'UTILISATION
Abstract:
(EN) A wiresaw cutting fluid composition of the present invention comprises 25 to 75 % by weight of a particulate abrasive suspended in an aqueous carrier containing a polymeric viscosity modifier that comprises a polymer including a majority of non-ionic monomer units (preferably 100 mol % non-ionic monomer units), has a number average molecular weight (Mn) of at least 5 kDa, and is present in the composition at a concentration sufficient to provide a Brookfield viscosity for the composition in the range of 50 to 1000 cP, e.g., 50 to 700 cP, at 25 °C at a spindle rotation rate of 60 rpm. In one embodiment, the viscosity modifier comprises a polymer having a weight average molecular weight (Mw) of at least 200 kDa. When a viscosity modifier of 200 kDa or greater Mw is utilized, a preferred wiresaw cutting method the cutting fluid is circulated and applied by pumps and nozzles operating at a relatively low shear rate of not more than 104 s-1.
(FR) Une composition de fluide de coupe de scie à fil de la présente invention comprend 25 à 75 % en poids d'un abrasif particulaire en suspension dans un véhicule aqueux contenant un modificateur de viscosité polymère qui comprend un polymère comprenant une majorité d'unités monomères non ioniques (de préférence 100 % en moles d'unités monomères non ioniques), possède une masse moléculaire moyenne en nombre (Mn) d'au moins 5 kDa, et est présent dans la composition à une concentration suffisante pour fournir une viscosité Brookfield pour la composition dans la plage de 50 à 1 000 cP, par exemple, 50 à 700 cP, à 25°C à une vitesse de rotation de broche de 60 tpm. Dans un mode de réalisation, le modificateur de viscosité comprend un polymère ayant une masse moléculaire moyenne en poids (Mw) d'au moins 200 kDa. Lorsqu'un modificateur de viscosité de 200 kDa ou d'une Mw supérieure est utilisée, un procédé de coupe de scie à fil préféré prévoit que le fluide de coupe soit amené à circuler et appliqué par des pompes et buses fonctionnant à une vitesse de cisaillement relativement faible de pas plus de 104 s-1.
Also published as:
IL213230SG172276JP2012512951CN102257092KR1020110099744MYPI 2011002875
WO/2010/080495