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1. EP3518032 - CAMERA MODULE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

Office
European Patent Office
Application Number 17852846
Application Date 08.09.2017
Publication Number 3518032
Publication Date 31.07.2019
Publication Kind B1
IPC
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
G02B 7/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
H04N 5/225
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment
225Television cameras
CPC
G02B 7/02
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
02for lenses
G03B 17/02
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
02Bodies
H04N 5/225
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
NPICTORIAL COMMUNICATION, e.g. TELEVISION
5Details of television systems
222Studio circuitry; Studio devices; Studio equipment ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, TV cameras, video cameras, camcorders, webcams, camera modules for embedding in other devices, e.g. mobile phones, computers or vehicles
225Television cameras ; ; Cameras comprising an electronic image sensor, e.g. digital cameras, video cameras, camcorders, webcams, camera modules specially adapted for being embedded in other devices, e.g. mobile phones, computers or vehicles
G03B 17/55
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
17Details of cameras or camera bodies; Accessories therefor
55with provision for heating or cooling, e.g. in aircraft
H05K 1/0203
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
H05K 1/0281
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0277Bendability or stretchability details
028Bending or folding regions of flexible printed circuits
0281Reinforcement details thereof
Applicants SONY SEMICONDUCTOR SOLUTIONS CORP
Inventors MOMIUCHI YUTA
TAKAOKA YUJI
NAKAYAMA HIROKAZU
TANAKA KIYOHISA
TOGAWA MIYOSHI
SEKI HIROKAZU
Designated States
Priority Data 2016185347 23.09.2016 JP
Title
(DE) KAMERAMODUL, HERSTELLUNGSVERFAHREN UND ELEKTRONISCHE VORRICHTUNG
(EN) CAMERA MODULE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
(FR) MODULE DE CAMÉRA, PROCÉDÉ DE FABRICATION ET DISPOSITIF ÉLECTRONIQUE
Abstract
(EN) The present technology relates to a camera module, a production method, and an electronic device that can prevent reduction of optical module positioning accuracy or heat dissipation performance.An image pickup element is joined on one face of a flexible board so that a light receiving surface of the image pickup element is exposed through an opening of the flexible board, and an optical module is joined on an other face of the flexible board so that light enters to the image pickup element through the opening. A reinforcing member is joined on the one face of the flexible board at a circumference of the image pickup element and reinforces a joining part of the flexible board where the optical module is joined. The reinforcing member is joined so as to face an area including at least a part of the joining part and is formed so that a part of the circumference of the image pickup element is kept open. The present technology can be applied to, for example, a camera module in which the image pickup element and the optical module are integrated.
(FR) La présente invention concerne un module de caméra, un procédé de fabrication et un dispositif électronique avec lesquels des réductions de précision de position et de performance de rayonnement thermique d'un module optique peuvent être supprimées. Un élément d'imagerie est joint à une surface d'un substrat souple de telle sorte qu'une surface de réception de lumière de l'élément d'imagerie soit exposée à partir d'une ouverture du substrat souple. Un module optique est joint à l'autre surface du substrat souple de façon à amener la lumière à être incidente sur l'élément d'imagerie, par l'intermédiaire de l'ouverture. Un élément de renforcement est joint à la périphérie de l'élément d'imagerie sur la surface du substrat souple, et renforce une partie de joint du substrat souple au niveau de laquelle le module optique est joint. L'élément de renforcement est joint de manière à s'opposer à une plage comprenant au moins une partie de la partie de joint, et est configuré de telle sorte qu'une partie de la périphérie de l'élément d'imagerie est ouverte. La présente technologie peut être appliquée, par exemple, à un module de caméra dans lequel un élément d'imagerie et un module optique sont intégrés.