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1. (EP3410471) WIRING SUBSTRATE, OPTICAL SEMICONDUCTOR ELEMENT PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE

Office : European Patent Office
Application Number: 17744322 Application Date: 26.01.2017
Publication Number: 3410471 Publication Date: 05.12.2018
Publication Kind : A4
Designated States: AL, AT, BA, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR
Prior PCT appl.: Application Number:JP2017002745 ; Publication Number: Click to see the data
IPC:
H01L 23/02
H01L 23/04
H01L 23/12
H01L 31/02
H01S 5/022
H05K 1/02
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
02
Containers; Seals
04
characterised by the shape
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31
Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02
Details
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
S
DEVICES USING STIMULATED EMISSION
5
Semiconductor lasers
02
Structural details or components not essential to laser action
022
Mountings; Housings
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
CPC:
H01L 23/047
H01L 23/053
H01L 23/057
H01L 2224/48091
H05K 1/0219
H05K 1/0227
H05K 1/024
H05K 1/0243
H05K 1/0253
H05K 2201/0191
H05K 2201/09036
H05K 2201/09236
H05K 2201/093
H05K 2201/09845
H05K 2201/10121
H05K 2203/1131
H01L 23/12
H01L 31/02
H01S 5/022
H01S 5/02212
H01S 5/02276
H05K 1/0245
H05K 1/0306
H05K 3/1216
H05K 2201/068
H05K 2201/09154
H05K 2201/10287
H05K 2201/10424
Applicants: KYOCERA CORP
Inventors: KITAMURA TOSHIHIKO
Priority Data: 2016012943 27.01.2016 JP
2017002745 26.01.2017 JP
Title: (DE) VERDRAHTUNGSSUBSTRAT, VERKAPSELUNG FÜR OPTISCHES HALBLEITERELEMENT UND OPTISCHES HALBLEITERELEMENT
(EN) WIRING SUBSTRATE, OPTICAL SEMICONDUCTOR ELEMENT PACKAGE, AND OPTICAL SEMICONDUCTOR DEVICE
(FR) SUBSTRAT DE CÂBLAGE, BOÎTIER D'ÉLÉMENT À SEMI-CONDUCTEUR OPTIQUE ET DISPOSITIF À SEMI-CONDUCTEUR OPTIQUE
Abstract: front page image
(EN) A wiring board includes a signal conductor wiring positioned on a first face of a first dielectric layer, and a ground conductor wiring positioned on a second face thereof. A region of the ground conductor wiring where a first end portion of the signal conductor wiring is positioned in plan view is cut away inwardly from a first side of the second face opposing a first side of the first face.
(FR) Le substrat de câblage de l’invention comporte un câblage conducteur de signal positionné sur une première surface d’une première couche diélectrique, et comporte une couche conductrice de masse positionnée sur une deuxième surface de celle-ci. Vu depuis une vue en plan, la région de la couche conductrice de masse, au niveau de laquelle une première partie d’extrémité du câblage conducteur de signal est positionnée, est entaillée vers l’intérieur depuis un premier côté de la deuxième surface qui correspond à un premier côté de la première surface.
Also published as:
CN108352363US20180352648WO/2017/131092