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1. EP3371827 - SOLENOID INDUCTOR

Office
European Patent Office
Application Number 16797704
Application Date 08.11.2016
Publication Number 3371827
Publication Date 12.09.2018
Publication Kind B1
IPC
H01L 23/522
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
H01F 17/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
17Fixed inductances of the signal type
04with magnetic core
H01F 27/28
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27Details of transformers or inductances, in general
28Coils; Windings; Conductive connections
H01F 27/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
27Details of transformers or inductances, in general
28Coils; Windings; Conductive connections
29Terminals; Tapping arrangements
H01F 41/06
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
41Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
02for manufacturing cores, coils or magnets
04for manufacturing coils
06Coil winding
H01L 23/64
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
CPC
H01L 23/3157
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3157Partial encapsulation or coating
H01L 23/5227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
522including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
5227Inductive arrangements or effects of, or between, wiring layers
H01L 23/645
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
58Structural electrical arrangements for semiconductor devices not otherwise provided for ; , e.g. in combination with batteries
64Impedance arrangements
645Inductive arrangements
H01L 24/16
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
H01L 24/49
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
49of a plurality of wire connectors
Applicants QUALCOMM INC
Inventors VELEZ MARIO FRANCISCO
MUDAKATTE NIRANJAN SUNIL
YUN CHANGHAN HOBIE
KIM DAEIK DANIEL
BERDY DAVID FRANCIS
KIM JONGHAE
MA YUNFEI
ZUO CHENGJIE
Designated States
Priority Data 201562252567 08.11.2015 US
15345312 07.11.2016 US
Title
(DE) ELEKTROMAGNETINDUKTOR
(EN) SOLENOID INDUCTOR
(FR) INDUCTEUR SOLÉNOÏDE
Abstract
(EN) An inductor with multiple loops and semiconductor devices with such an inductor integrated thereon are proposed. In an aspect, the semiconductor device may include a die on a substrate, an inductor on the die in which the inductor comprises a wire with multiple non planar loops above the die. In another aspect, the semiconductor device may include a plurality of posts on a die on a substrate, and an inductor on the die. The inductor may include a wire looped around the plurality of posts such that the inductor includes multiple non-planar loops.
(FR) La présente invention concerne un inducteur à boucles multiples et des dispositifs semi-conducteurs sur lesquels un tel inducteur est monté. Selon un aspect, le dispositif semi-conducteur peut comprendre une puce placée sur un substrat et un inducteur placé sur la puce. L'inducteur comporte un fil présentant de multiples boucles non planes situées au-dessus de la puce. Selon un autre aspect, le dispositif semi-conducteur peut comprendre une pluralité de montants disposés sur une puce placée sur un substrat, ainsi qu'un inducteur disposé sur la puce. L'inducteur peut contenir un fil enroulé autour de la pluralité de montants de telle sorte que l'inducteur présente de multiples boucles non planes.