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1. EP3271940 - THERMAL SPREADER HAVING INTER-METAL DIFFUSION BARRIER LAYER

Office European Patent Office
Application Number 16713246
Application Date 18.03.2016
Publication Number 3271940
Publication Date 24.01.2018
Publication Kind A1
IPC
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
CPC
H01L 23/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
F28F 21/085
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
21Constructions of heat-exchange apparatus characterised by the selection of particular materials
08of metal
081Heat exchange elements made from metals or metal alloys
085from copper or copper alloys
F28F 21/087
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
21Constructions of heat-exchange apparatus characterised by the selection of particular materials
08of metal
081Heat exchange elements made from metals or metal alloys
087from nickel or nickel alloys
F28F 21/089
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
21Constructions of heat-exchange apparatus characterised by the selection of particular materials
08of metal
089Coatings, claddings or bonding layers made from metals or metal alloys
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 23/3731
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3731Ceramic materials or glass
Applicants RAYTHEON CO
Inventors TRULLI SUSAN C
Designated States
Priority Data 14664310 20.03.2015 US
2016023048 18.03.2016 US
Title
(DE) WÄRMEVERTEILER MIT INTERMETALL-DIFFUSIONSSPERRSCHICHT
(EN) THERMAL SPREADER HAVING INTER-METAL DIFFUSION BARRIER LAYER
(FR) DIFFUSEUR THERMIQUE À COUCHE DE BARRIÈRE DE DIFFUSION INTERMÉTAL
Abstract
(EN)
A heat spreader provided having: a ceramic substrate; and metallization layer structure disposed on at least one surface of the substrate. The metallization layer structure includes: a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; and a heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer. The diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer. The metallization layer structure is disposed on a plurality of sides of the substrate.

(FR)
L’invention concerne un diffuseur de chaleur comportant : un substrat de céramique ; et une structure de couches de métallisation disposée sur au moins une surface du substrat. La structure de couches de métallisation inclut : une couche en pellicule épaisse disposée sur la ou les surfaces du substrat ; une couche de barrière de diffusion sur la couche en pellicule épaisse et en contact direct avec elle ; et une couche conductrice de chaleur disposée sur la couche de barrière de diffusion et en contact direct avec elle. La couche de barrière de diffusion inhibe la diffusion du matériau dans la couche en pellicule épaisse et du matériau dans la couche conductrice de chaleur entre la couche en pellicule épaisse et la couche conductrice de chaleur. La structure de couches de métallisation est disposée sur une pluralité de côtés du substrat.

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