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1. EP3262132 - DEBONDABLE REACTIVE HOT MELT ADHESIVES

Office European Patent Office
Application Number 16706876
Application Date 29.02.2016
Publication Number 3262132
Publication Date 03.01.2018
Publication Kind A1
IPC
C09J 175/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
175Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
02Polyureas
CPC
C08K 5/1575
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
04Oxygen-containing compounds
15Heterocyclic compounds having oxygen in the ring
156having two oxygen atoms in the ring
1575Six-membered rings
C08K 5/42
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
5Use of organic ingredients
36Sulfur-, selenium-, or tellurium-containing compounds
41Compounds containing sulfur bound to oxygen
42Sulfonic acids; Derivatives thereof
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 11/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
02Non-macromolecular additives
06organic
C09J 11/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
08Macromolecular additives
C09J 175/04
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
175Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
04Polyurethanes
Applicants HENKEL AG & CO KGAA
Inventors HEUCHER REIMAR
FORD ISABELLE
JOSEPH JULIE
CRAWFORD ALASDAIR
Designated States
Priority Data 15157011 27.02.2015 EP
Title
(DE) ABLÖSBARE REAKTIVE SCHMELZHAFTKLEBER
(EN) DEBONDABLE REACTIVE HOT MELT ADHESIVES
(FR) ADHÉSIFS THERMOFUSIBLES RÉACTIFS DÉCOLLABLES
Abstract
(EN)
The present invention relates to a reactive hot melt adhesive composition, which at least partially loses its adhesiveness upon application of an electric voltage and thus allows debonding of substrates that have been bonded using said adhesive. Furthermore, the present invention relates to a method for its production and a method for forming a bonded substrate using such a reactive hot melt adhesive composition.

(FR)
La présente invention concerne une composition d'adhésif thermofusible réactif, qui perd au moins partiellement son adhésivité après application d'une tension électrique et permet ainsi de décoller des substrats qui ont été collés à l'aide dudit adhésif. En outre, la présente invention concerne un procédé pour sa production et un procédé de formation d'un substrat collé à l'aide de ladite composition d'adhésif thermofusible réactif.

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