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1. EP1926678 - A method of manufacturing a microsystem

Office European Patent Office
Application Number 06795768
Application Date 24.08.2006
Publication Number 1926678
Publication Date 04.06.2008
Publication Kind B1
IPC
B81C 99/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
99Subject matter not provided for in other groups of this subclass
F04B 43/04
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
04POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
43Machines, pumps, or pumping installations having flexible working members
02having plate-like flexible members, e.g. diaphragms
04Pumps having electric drive
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
F16K 99/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
16ENGINEERING ELEMENTS OR UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
KVALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
99Subject matter not provided for in other groups of this subclass
H04R 17/02
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
17Piezo-electric transducers; Electrostrictive transducers
02Microphones
H04R 19/01
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
01characterised by the use of electrets
CPC
B01L 3/502707
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
3Containers or dishes for laboratory use, e.g. laboratory glassware
50Containers for the purpose of retaining a material to be analysed, e.g. test tubes
502with fluid transport, e.g. in multi-compartment structures
5027by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
502707characterised by the manufacture of the container or its components
B01L 3/502738
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
3Containers or dishes for laboratory use, e.g. laboratory glassware
50Containers for the purpose of retaining a material to be analysed, e.g. test tubes
502with fluid transport, e.g. in multi-compartment structures
5027by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
502738characterised by integrated valves
B01L 2200/10
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2200Solutions for specific problems relating to chemical or physical laboratory apparatus
10Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
B01L 2200/12
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2200Solutions for specific problems relating to chemical or physical laboratory apparatus
12Specific details about manufacturing devices
B01L 2300/0627
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2300Additional constructional details
06Auxiliary integrated devices, integrated components
0627Sensor or part of a sensor is integrated
B01L 2300/0819
BPERFORMING OPERATIONS; TRANSPORTING
01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
2300Additional constructional details
08Geometry, shape and general structure
0809rectangular shaped
0819Microarrays; Biochips
Applicants KONINKL PHILIPS ELECTRONICS NV
Inventors LANGEREIS GEERT
WEEKAMP JOHANNES WILHELMUS
GIESBERS JACOBUS BERNARDUS
Designated States
Priority Data 05108276 09.09.2005 EP
06795768 24.08.2006 EP
Title
(DE) Verfahren zur Herstellung eines Mikrosystems
(EN) A method of manufacturing a microsystem
(FR) Procéde de fabrication de microsystéme
Abstract
(EN)
The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils (10) having a conductive layer (l la,l lb) on at least one side. After stacking, the foils (10) are sealed, using pressure and heat. Finally the microsystems are separated from the stack (S). The pre-processing of the foils (preferably done by means of a laser beam) comprises a selection of the following steps: (A) leaving the foil intact, (B) locally removing the conductive layer, (C) removing the conductive layer and partially evaporating the foil (10), and (D) removing both the conductive layer as well as foil (10), thus making holes in the foil (10). In combination with said stacking, it is possible to create cavities, freely suspended cantilevers and membranes. This opens up the possibility of manufacturing various microsystems, like MEMS devices and microfluidic systems.

(FR)
L'invention concerne un procédé de fabrication d'un microsystème ainsi que ce même microsystème. Le procédé de fabrication de ce microsystème peut consister à : empiler des feuilles prétraitées (10) pourvues d'une couche conductrice (11a, 11b) sur au moins un côté ; sceller les feuilles ainsi empilées sous l'effet de la chaleur et de la compression ; et enfin, séparer les microsystèmes de l'empilement (S). Le prétraitement des feuilles (réalisé de préférence par faisceau laser) comprend une sélection des opérations suivantes: (A) laisser la feuille intacte ; (B) décoller localement la couche conductrice ; (C) retirer la couche conductrice et vaporiser partiellement la feuille (10) ; et enfin, (D) retirer à la fois la couche conductrice et la feuille (10), de manière à former des trous dans la feuille (10). En plus de cet empilement, il est possible de former des cavités, des membranes et des porte-à-faux librement suspendus. Ce qui, par conséquent, offre la possibilité de fabriquer divers microsystèmes, tels que les dispositifs MEMS et les systèmes microfluidiques.