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1. (EP1909142) PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER

Office : European Patent Office
Application Number: 06732022 Application Date: 18.04.2006
Publication Number: 1909142 Publication Date: 09.04.2008
Publication Kind : A4
Designated States: AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LI, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR
Prior PCT appl.: Application Number:JP2006308093 ; Publication Number: Click to see the data
IPC:
G03F 7/085
C08K 5/544
G03F 7/075
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
085
Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
544
containing nitrogen
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
CPC:
G03F 7/0751
C08K 5/0025
C08K 5/544
G03F 7/0045
G03F 7/0226
G03F 7/0755
Y10S 430/106
Y10S 430/111
Y10S 430/115
Y10S 430/117
Applicants: TORAY INDUSTRIES
Inventors: YUBA TOMOYUKI
FUJITA YOJI
TOMIKAWA MASAO
Priority Data: 2005191346 30.06.2005 JP
2006308093 18.04.2006 JP
Title: (DE) LICHTEMPFINDLICHE HARZZUSAMMENSETZUNG UND HAFTVERBESSERER
(EN) PHOTOSENSITIVE RESIN COMPOSITION AND ADHESION ENHANCER
(FR) COMPOSITION DE RÉSINE PHOTOSENSIBLE ET AMPLIFICATEUR D ADHÉSION
Abstract:
(EN) The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.
(FR) Composition de résine photosensible comprenant une résine alcaline soluble (a), un composé de silicium (b) comportant un aromatique secondaire amino et alkoxyle et au moins un élément (c) sélectionné parmi un initiateur de photopolymérisation, un générateur de photoacide ou un générateur de photobase. La présente invention permet ainsi d’obtenir une composition de résine photosensible qui, sans détriment à la stabilité d’entreposage de la solution, améliore considérablement l’adhésion avec un substrat après cuisson et même au développement n'est pas sujette à un écaillage microscopique.
Also published as:
KR1020080028464JPWO2007004345US20090123867CN101213491JP5087923WO/2007/004345