Processing

Please wait...

Settings

Settings

Goto Application

1. EP1904398 - A METHOD OF MANUFACTURING A MEMS ELEMENT

Office
European Patent Office
Application Number 06765888
Application Date 27.06.2006
Publication Number 1904398
Publication Date 02.04.2008
Publication Kind A2
IPC
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
CPC
B81B 2203/0118
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0118Cantilevers
B81B 2203/0315
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
03Static structures
0315Cavities
B81C 1/00047
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00023without movable or flexible elements
00047Cavities
B81C 1/00182
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
00015for manufacturing microsystems
00134comprising flexible or deformable structures
00182Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
B81C 2201/0109
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
2201Manufacture or treatment of microstructural devices or systems
01in or on a substrate
0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
0102Surface micromachining
0105Sacrificial layer
0109Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
B81C 1/00
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
1Manufacture or treatment of devices or systems in or on a substrate
Applicants PHILIPS INTELLECTUAL PROPERTY
KONINKL PHILIPS ELECTRONICS NV
Inventors DUEMLING MARTIN
POHLMANN HAUKE
LANGEREIS GEERT
DEKKER RONALD
Designated States
Priority Data 05105869 30.06.2005 EP
06765888 27.06.2006 EP
Title
(DE) HERSTELLUNGSVERFAHREN FÜR EIN MEMS-ELEMENT
(EN) A METHOD OF MANUFACTURING A MEMS ELEMENT
(FR) PROCEDE DE FABRICATION D'UN ELEMENT MICROELECTROMECANIQUE
Abstract
(EN) The device (100) comprises a substrate (10) of a semiconductor material with a first and an opposite second surface (1,2) and a microelectromechanical (MEMS) element (50) which is provided with a fixed and a movable electrode (52, 51) that is present in a cavity (30). One of the electrodes (51,52) is defined in the substrate (10). The movable electrode (51) is movable towards and from the fixed electrode (52) between a first gapped position and a second position. The cavity (30) is opened through holes (18) in the substrate (10) that are exposed on the second surface (2) of the substrate (10). The cavity (30) has a height that is defined by at least one post (15) in the substrate (10), which laterally substantially surrounds the cavity (15).
(FR) L'invention concerne un dispositif (100) présentant un substrat (10) en matériau semi-conducteur pourvu d'une première surface et d'une seconde surface opposée (1, 2) et un élément microélectromécanique (MEMS) (50) pourvu d'une électrode fixe et d'une électrode mobile (52, 51) qui se trouve dans une cavité (30). Une des électrodes (51, 52) est formée dans le substrat (10). L'électrode mobile (51) peut se déplacer vers et depuis l'électrode fixe (52) entre une première position écartée position et une seconde position. La cavité (30) est ouverte par le biais de trous (18) formés dans le substrat (10) et s'ouvrant sur la seconde surface (2) du substrat (10). Cette cavité (30) présente une hauteur définie par au moins un support (15) dans le substrat (10), qui entoure sensiblement les côtés de ladite cavité.