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1. (EP1902003) LOCALIZED SURFACE ANNEALING OF COMPONENTS FOR SUBSTRATE PROCESSING CHAMBERS

Office : European Patent Office
Application Number: 06787040 Application Date: 12.07.2006
Publication Number: 1902003 Publication Date: 26.03.2008
Publication Kind : B1
Designated States: DE, FR, GB, IE, NL
Prior PCT appl.: Application Number:US2006027078 ; Publication Number: Click to see the data
IPC:
H01L 21/67
B23K 26/00
C03B 25/02
C04B 41/00
H01L 21/683
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
C CHEMISTRY; METALLURGY
03
GLASS; MINERAL OR SLAG WOOL
B
MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
25
Annealing glass products
02
in a discontinuous way
C CHEMISTRY; METALLURGY
04
CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
B
LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
41
After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67
Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683
for supporting or gripping
CPC:
C04B 41/0036
B23K 26/352
C03B 25/02
H01L 21/67115
H01L 21/6831
Y10T 428/131
Applicants: APPLIED MATERIALS INC
Inventors: BHATNAGAR ASHISH
MURUGESH LAXMAN
GOPALAKRISHNAN PADMA
Priority Data: 18104105 13.07.2005 US
2006027078 12.07.2006 US
Title: (DE) LOKALISIERTES OBERFLÄCHENGLÜHEN VON KOMPONENTEN FÜR SUBSTRATBEHANDLUNGSKAMMERN
(EN) LOCALIZED SURFACE ANNEALING OF COMPONENTS FOR SUBSTRATE PROCESSING CHAMBERS
(FR) RECUIT SUPERFICIEL LOCALISE DE COMPOSANTS POUR CHAMBRES DE TRAITEMENT DE SUBSTRAT
Abstract: front page image
(EN) A substrate processing chamber component has a structural body with localized surface regions having annealed microcracks. The annealed microcracks reduce crack propagation and increase fracture resistance. In one method of manufacture, the structural body of the component is formed by conventional means, and a laser beam is directed onto localized surface regions of the body for a sufficient time to anneal the surface microcracks.
(FR) Cette invention concerne un composant de chambre de traitement de substrat comprenant un corps structurel pourvu de zones superficielles localisées comportant des microfissures recuites. Les microfissures recuites réduisent la propagation des fissures et augmentent la résistance à la rupture. Dans un procédé de fabrication, le corps structurel du composant est formé au moyen de procédés conventionnels, et un faisceau laser est dirigé sur les zones superficielles localisées du corps pendant une durée suffisante pour que les microfissures superficielles soit recuites.
Also published as:
KR1020080033181JP2009501452US20070014949CN101218191WO/2007/008999