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1. EP1850352 - CONDUCTIVE PASTE

Office
European Patent Office
Application Number 06712054
Application Date 20.01.2006
Publication Number 1850352
Publication Date 31.10.2007
Publication Kind A4
IPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/09
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 3/4069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
4038Through-connections; Vertical interconnect access [VIA] connections
4053by thick-film techniques
4069for via connections in organic insulating substrates
Applicants FUJIKURA KASEI KK
ASAHI KASEI E MATERIALS CORP
Inventors HIRAKAWA YOHEI
WAKABAYASHI KATSUTOMO
YOTSUYANAGI YUTA
TANAKA NORIHITO
Designated States
Priority Data 2005016965 25.01.2005 JP
Title
(DE) LEITFĂ„HIGE PASTE
(EN) CONDUCTIVE PASTE
(FR) PATE CONDUCTRICE
Abstract
(EN)
A conductive paste that includes a binder containing a thermosetting resin and conductive particles, in which the lowest exothermic peak temperature T 1 (degrees C) among at least one exothermic peak obtained by differential scanning calorimetry of the binder and the lowest endothermic peak temperature t 1 (degrees C) among at least one endothermic peak obtained by differential scanning calorimetry of the conductive particles satisfy the relation t 1 - 20 < T 1 ... (1), thereby achieving good conductivity and excellent conductive connection reliability.

(FR)
La présente invention concerne une pâte conductrice présentant une excellente conductivité et une excellente fiabilité de connexion conductrice qui contient un liant contenant une résine thermodurcissable et des particules conductrices. La température de crête de génération de chaleur la plus basse T1 (degrés C) parmi au moins une crête de génération de chaleur obtenue par une mesure calorimétrique à compensation de puissance du liant et la température de crête d’absorption de chaleur la plus basse t1 (degrés C) parmi au moins une crête d’absorption de chaleur obtenue par une mesure calorimétrique à compensation de puissance des particules conductrices satisfont la relation suivante : t1 - 20 < T1 ... (1).