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1. EP1291902 - Method and apparatus for drying substrates

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Office
European Patent Office
Application Number 02080041
Application Date 05.08.1998
Publication Number 1291902
Publication Date 12.03.2003
Publication Kind A2
IPC
F26B 5/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
5Drying solid materials or objects by processes not involving the application of heat
F26B 9/06
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
9Machines or apparatus for drying solid materials or objects at rest or with only local agitation; Domestic airing cupboards
06in stationary drums or chambers
F26B 21/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
26DRYING
BDRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
21Arrangements for supplying or controlling air or gases for drying solid materials or objects
H01L 21/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/687
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
CPC
H01L 21/67034
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
67034for drying
H01L 21/68728
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68728characterised by a plurality of separate clamping members, e.g. clamping fingers
Y10S 134/902
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
134Cleaning and liquid contact with solids
902Semiconductor wafer
Applicants APPLIED MATERIALS INC
Inventors FISHKIN BORIS
HEARNE JOHN S
LOWRANCE ROBERT B
Designated States
Priority Data 98938391 05.08.1998 EP
08908245 07.08.1997 US
Title
(DE) Verfahren und Vorrichtung zum Trocknen von Substraten
(EN) Method and apparatus for drying substrates
(FR) Procédé et dispositif de sèchage de substrats
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Abstract
(EN) A drying apparatus 20 for removing residual liquid from a substrate surface comprises a vapor chamber 25 having a vapor distributor 30 for introducing vapor into the chamber. The drying apparatus 20 further comprises a fluid system 35 comprising (i) a reservoir 40, (ii) a fluid dispenser 45 for introducing fluid into the reservoir, and (iii) a fluid level adjuster 50 for lowering a fluid surface level in the reservoir 40. A multi-point holder 62 is used for holding the substrate 55 at different holding points 63 on the substrate, while the fluid surface level is lowered relative to the substrate, so that residual liquid flows off the substrate surface without intersection of the lowering fluid surface level with holding points 63 on the substrate. The drying apparatus 20 dries substrates 55 substantially without forming stains or streaks, or causing contamination or liquid residue to remain on the substrate 55.
(FR) Ce dispositif de séchage (20) destiné à enlever un liquide résiduel à partir d'une surface d'un substrat, comprend une chambre à vapeur (25) présentant un distributeur de vapeur (30) servant à introduire la vapeur dans la chambre, ainsi qu'un système fluidique (35) comportant (i) un réservoir (40), (ii) un distributeur de fluide (45) destiné à introduire un fluide dans le réservoir, et (iii) un régleur de niveau de fluide (50) servant à abaisser le niveau de la surface du fluide dans le réservoir (40). On utilise un support (62) à plusieurs points de support pour tenir le substrat (55) au niveau de différents points de support (63) situés sur le substrat, tandis que l'on abaisse le niveau de la surface du fluide par rapport au substrat, de façon que le liquide résiduel s'élimine de la surface du substrat sans que le niveau de la surface en cours d'abaissement ne croise les points de support (63) du substrat. Ce dispositif de séchage (20) sèche des substrats (55) sans former sensiblement de taches ou de stries et sans laisser de contaminants ou de résidu liquide sur le substrat (55).
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