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1. DE112019002513 - POLIERKOPF, DIESEN VERWENDENDE WAFER-POLIEREINRICHTUNG UND DIESEN VERWENDENDES WAFER-POLIERVERFAHREN

Office
Germany
Application Number 112019002513
Application Date
Publication Number 112019002513
Publication Date 25.02.2021
Publication Kind T5
IPC
B24B 37/30
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
B24B 37/32
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
32Retaining rings
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
B24B 37/32
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
32Retaining rings
B24B 37/30
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
B24B 57/02
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
57Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
02for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
H01L 21/67092
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67092Apparatus for mechanical treatment
B24B 7/228
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
7Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
20characterised by a special design with respect to properties of the material of non-metallic articles to be ground
22for grinding inorganic material, e.g. stone, ceramics, porcelain
228for grinding thin, brittle parts, e.g. semiconductors, wafers
B24B 37/107
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
10for single side lapping
105the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
107in a rotary movement only, about an axis being stationary during lapping
Applicants SUMCO Corporation
Inventors Nakano Yuki
Sugimori Katsuhisa
Kozasa Kazuaki
Kajiwara Jiro
Yamamoto Katsutoshi
Kihara Takayuki
Terakawa Ryoya
Agents Kraus & Weisert Patentanwälte PartGmbB
Priority Data 2018095300 17.05.2018 JP
Title
(DE) POLIERKOPF, DIESEN VERWENDENDE WAFER-POLIEREINRICHTUNG UND DIESEN VERWENDENDES WAFER-POLIERVERFAHREN
Abstract
(DE)

Problem: Es soll eine Welligkeit eines Polierdrucks bei einem Außenumfang eines Wafers abgestellt und eine hohe Ebenheit erzielt werden. Mittel zur Lösung des Problems: ein Polierkopf 10 einer Wafer-Poliereinrichtung ist versehen mit: einem Membrankopf 16, welcher unabhängig einen Mittensteuerdruck Pc zum Andrücken eines Mittenabschnitts eines Wafers W und einen Außenumfangs-Steuerdruck Pe zum Andrücken eines Außenumfangsabschnitts des Wafers W steuern kann; einem Außenring 17, welcher in dem Membrankopfes 16 integriert ist, um so den Außenumfangsabschnitt des Membrankopfes 16 zu bilden; und einen Haltering 14 vom Kontakttyp, welcher außerhalb des Membrankopfes 16 vorhanden ist. Der Membrankopf 16 weist eine Mittendruckkammer R1 von einer Struktur mit nur einer Kammer, welche den Mittensteuerdruck Pc steuert, und eine Außenumfangs-Druckkammer R2, welche oberhalb der Mittenabschnittsdruckkammer R1 vorhanden ist und den Außenumfangs-Steuerdruck Pe steuert, auf. Eine Position eines unteren Endes des Außenrings 17 erreicht zumindest eine Position einer Innenbodenfläche S1 der Mittendruckkammer R1, und eine Position eines oberen Endes des Außenrings 17 erreicht zumindest eine Position einer inneren oberen Fläche S2 der Mittendruckkammer R1.