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1. DE102019115500 - Anordnung und Verfahren zur Herstellung einer Anordnung

Office Germany
Application Number 102019115500
Application Date 07.06.2019
Publication Number 102019115500
Publication Date 10.12.2020
Publication Kind A1
IPC
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
H01L 23/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
CPC
F21V 29/503
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
502characterised by the adaptation for cooling of specific components
503of light sources
F21V 29/763
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
50Cooling arrangements
70characterised by passive heat-dissipating elements, e.g. heat-sinks
74with fins or blades
76with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
763the planes containing the fins or blades having the direction of the light emitting axis
H05K 1/0204
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0203Cooling of mounted components
0204using means for thermal conduction connection in the thickness direction of the substrate
Applicants OSRAM CONTINENTAL GmbH
Inventors Gasser Hans-Friedrich
Austerer Maximilian
Agents Winter, Brandl, Fürniss, Hübner, Röss, Kaiser, Polte Partnerschaft mbB, Patentanwälte
Title
(DE) Anordnung und Verfahren zur Herstellung einer Anordnung
Abstract
(DE)

Offenbart ist eine Anordnung mit einer Leiterplatte (1) zur mechanischen Befestigung und elektrischen Verbindung von Bauelementen, mit einer Leiterplatte (1) und einem an einer ersten Seite (9a) der Leiterplatte (1) befestigten Kühlkörper (5; 11) zur Kühlung der Anordnung. In der Leiterplatte (1) ist eine Ausnehmung (3) vorgesehen und zumindest ein Abschnitt des Kühlkörpers (5; 11) ist durch die Ausnehmung (3) geführt und kragt von einer der ersten Seite (9a) der Leiterplatte (1) wegweisenden zweiten Seite (9b) der Leiterplatte (1) weg. embedded image

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