Processing

Please wait...

Settings

Settings

Goto Application

1. CN103329346 - 用于使用激光制造三维导线图案的方法以及设备

Office China
Application Number 201180064479.X
Application Date 04.11.2011
Publication Number 103329346
Publication Date 25.09.2013
Publication Kind A
IPC
H01Q 1/38
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
36Structural form of radiating elements, e.g. cone, spiral, umbrella
38formed by a conductive layer on an insulating support
B23K 26/36
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
CPC
H05K 3/185
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
18using precipitation techniques to apply the conductive material
181by electroless plating
182characterised by the patterning method
185by making a catalytic pattern by photo-imaging
B23K 26/08
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
B23K 26/702
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
70Auxiliary operations or equipment
702Auxiliary equipment
H01Q 1/243
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
12Supports; Mounting means
22by structural association with other equipment or articles
24with receiving set
241used in mobile communications, e.g. GSM
242specially adapted for hand-held use
243with built-in antennas
H01Q 1/38
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
QANTENNAS, i.e. RADIO AERIALS
1Details of, or arrangements associated with, antennas
36Structural form of radiating elements, e.g. cone, spiral, umbrella; ; Particular materials used therewith
38formed by a conductive layer on an insulating support
H05K 2201/0236
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
02Fillers; Particles; Fibers; Reinforcement materials
0203Fillers and particles
0206Materials
0236Plating catalyst as filler in insulating material
Applicants 黄基善
尹正洙
Inventors 尹正洙
金美善
Agents 北京集佳知识产权代理有限公司 11227
北京集佳知识产权代理有限公司 11227
Priority Data 10-2010-0111075 09.11.2010 KR
Title
(ZH) 用于使用激光制造三维导线图案的方法以及设备
Abstract
(ZH)

本公开涉及用于制造三维导线图案(诸如用于便携式通信装置的内装式天线)的方法以及设备。根据本发明的用于制造三维导线图案的设备包括:激光照射装置,其能够通过使用激光在三维形状的基板的表面上沿着期望轨迹进行照射,而选择性地对三维形状的基板的表面进行加工;以及夹具,其在由激光照射装置进行的激光照射期间固定和支撑基板,其中,该夹具在其上表面处设置有:第一固定部分,该第一固定部分固定基板以允许基板的前表面面朝上;以及第二固定部分,该第二固定部分固定基板以允许基板的后表面面朝上。根据本发明,由于使用了激光加工、电镀、以及具有特定结构的夹具,因此能够以高生产率在三维形状基板的表面上直接形成三维形状的导线图案。

Also published as