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1. CN102482540 - 用于超声波粘合的各向异性导电粘合剂、和使用其的电子部件连接方法

Office China
Application Number 201080040543.6
Application Date 27.01.2010
Publication Number 102482540
Publication Date 30.05.2012
Grant Number 102482540
Grant Date 19.06.2013
Publication Kind B
IPC
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 5/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
02involving pretreatment of the surfaces to be joined
CPC
C08K 7/16
CCHEMISTRY; METALLURGY
08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
KUse of inorganic or non-macromolecular organic substances as compounding ingredients
7Use of ingredients characterised by shape
16Solid spheres
C09J 5/06
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
5Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
06involving heating of the applied adhesive
C09J 9/02
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
C09J 11/08
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
11Features of adhesives not provided for in group C09J9/00, e.g. additives
08Macromolecular additives
C09J 2203/326
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2203Applications of adhesives in processes or use of adhesives in the form of films or foils
326for bonding electronic components such as wafers, chips or semiconductors
C09J 2301/416
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIAL AS ADHESIVES
2301Additional features of adhesives in the form of films or foils
40characterized by the presence of essential components
416use of irradiation
Applicants 韩国科学技术院
Inventors 白京煜
李技元
金承镐
Agents 北京市柳沈律师事务所 11105
Title
(ZH) 用于超声波粘合的各向异性导电粘合剂、和使用其的电子部件连接方法
Abstract
(ZH)

本发明涉及用于超声波粘合的各向异性导电粘合剂(ACA),其电连接作为第一电子部件的连接部分的电极的第一电极和作为第二电子部件的连接部分的电极的第二电极。该用于超声波粘合的各向异性导电粘合剂包括:绝缘聚合物树脂;导电的粘合剂颗粒,其通过由施加至该各向异性导电粘合剂的超声波产生的热而熔化;和间隔物颗粒,其具有高于粘合剂颗粒的熔点。使粘合剂颗粒熔化并与选自第一电极和第二电极的至少一个电极进行表面接触,并且使所述第一电极和所述第二电极以通过所述间隔物颗粒在所述第一电极和所述第二电极之间所保持的恒定间隙电连接。

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