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1. CN102405654 - 麦克风

Office
China
Application Number 201080017052.X
Application Date 20.04.2010
Publication Number 102405654
Publication Date 04.04.2012
Publication Kind A
IPC
H04R 19/00
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
H04R 31/00
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
31Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
H04R 7/18
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers; Cones
16Mounting or tensioning of diaphragms or cones
18at the periphery
CPC
H04R 19/005
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
005using semiconductor materials
B81B 3/0072
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0064Constitution or structural means for improving or controlling the physical properties of a device
0067Mechanical properties
0072For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
B81B 2201/0257
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
02Sensors
0257Microphones or microspeakers
B81B 2203/0127
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
01Suspended structures, i.e. structures allowing a movement
0127Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
H04R 7/18
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
7Diaphragms for electromechanical transducers
16Mounting or tensioning of diaphragms or cones
18at the periphery
H04R 19/04
HELECTRICITY
04ELECTRIC COMMUNICATION TECHNIQUE
RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
19Electrostatic transducers
04Microphones
Applicants 楼氏电子亚洲有限公司
Inventors 格特·兰格雷斯
特温·范利庞
弗雷迪·罗洛博姆
希尔柯·瑟伊
克劳斯·雷曼
约瑟夫·托马斯·马丁内斯·范贝克
卡斯·范·德·阿沃尔特
约翰内斯·范·温格登
金·范乐
马特吉·戈森斯
皮特·杰勒德·斯蒂内肯
Agents 中科专利商标代理有限责任公司 11021
Priority Data 09100240 20.04.2009 EP
Title
(ZH) 麦克风
Abstract
(ZH)

麦克风包括衬底(20)、限定了声学输入表面的麦克风膜(10)以及背板(11),所述背板相对于膜在背板(11)和膜(10)之间以固定间距支撑。麦克风外围区域包括膜(10)和背板(11)中的平行折皱(24)。通过对膜及背板使用相同的起皱悬浮物,最优地抑制体噪声的灵敏度。


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