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1. CN102264539 - Copper foil with resin

Office China
Application Number 200980152770.5
Application Date 10.12.2009
Publication Number 102264539
Publication Date 30.11.2011
Grant Number 102264539
Grant Date 19.08.2015
Publication Kind B
IPC
B PERFORMING OPERATIONS; TRANSPORTING
32
LAYERED PRODUCTS
B
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15
Layered products essentially comprising metal
04
comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08
of synthetic resin
088
comprising polyamides
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
09
Use of materials for the metallic pattern
B32B 15/088
H05K 1/09
CPC
H05K 3/386
H05K 2201/0154
H05K 2201/0209
H05K 2201/0358
Y10T 428/31681
Applicants 三菱瓦斯化学株式会社
株式会社PI技术研究所
Inventors 野崎充
大森贵文
野本昭宏
秋山教克
永田英史
矢野真司
Agents 北京同立钧成知识产权代理有限公司 11205
Priority Data 2008-334408 26.12.2008 JP
Title
(EN) Copper foil with resin
(ZH) 树脂复合铜箔
Abstract
(EN)
Disclosed is a copper foil with a resin, which permits the application of a copper foil having an extremely low-roughness matte surface, without impairing the adhesiveness to the resin composition of a copper-clad laminate. Specifically disclosed is a copper foil with a resin, which is provided with both a copper foil and a polyimide resin layer, said polyimide resin layer containing both a specific block copolyimide resin and an inorganic filler.

(ZH)

一种树脂复合铜箔,其可应用铜箔(粗化)面的凹凸极小的铜箔、而不会损害与覆铜层迭板的树脂组成物的粘接力。更详细而言,该树脂复合铜箔包括:铜箔以及聚酰亚胺树脂层,该聚酰亚胺树脂层含有特定的嵌段共聚合聚酰亚胺树脂以及无机填充剂。