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1. (CN102264793) Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board, and semiconductor device

Office : China
Application Number: 200980152101.8 Application Date: 22.12.2009
Publication Number: 102264793 Publication Date: 30.11.2011
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2009071334 ; Publication Number:2010074085 Click to see the data
IPC:
C08G 59/50
C08G 59/68
C08J 5/24
C08K 3/00
C08K 5/50
C08L 63/00
C08L 79/00
H05K 1/03
H05K 3/46
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
40
characterised by the curing agents used
50
Amines
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
G
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
59
Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
18
Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
68
characterised by the catalysts used
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H142
5
Manufacture of articles or shaped materials containing macromolecular substances
24
Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
3
Use of inorganic ingredients
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
49
Phosphorus-containing compounds
50
Phosphorus bound to carbon only
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
63
Compositions of epoxy resins; Compositions of derivatives of epoxy resins
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
L
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
79
Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08L61/-C08L77/259
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
03
Use of materials for the substrate
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
CPC:
H05K 1/0373
C08G 59/688
C08K 5/50
C08L 63/00
H05K 3/4626
Y10T 428/24994
Y10T 428/24995
Y10T 428/249951
Y10T 428/249952
Y10T 428/31511
Y10T 428/31515
Y10T 428/31522
Y10T 428/31529
Applicants: Sumitomo Bakelite Co.
住友电木株式会社
Inventors: Umeno Kuniharu
梅野邦治
Agents: cui xiangdan zhang yongkang
隆天国际知识产权代理有限公司 72003
隆天国际知识产权代理有限公司 72003
Priority Data: 2008-329012 25.12.2008 JP
Title: (EN) Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board, and semiconductor device
(ZH) 树脂组合物、半固化片、树脂片、覆金属层叠板、印刷布线板、多层印刷布线板及半导体装置
Abstract: front page image
(EN) Disclosed is a resin composition which, when used in a multilayer printed wiring board which requires fine wiring work, exhibits a low thermal expansion coefficient, as well as higher heat-resistance, resistance to burning, and insulation reliability than with the prior art. Further disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board, and a semiconductor device which use said resin composition. The resin composition contains as the essential components (A) an epoxy resin, (B) a cyanate resin, and (C) an onium salt compound.
(ZH)

本发明提供一种树脂组合物以及使用该树脂组合物的半固化片、树脂片、覆金属层叠板、印刷布线板、多层印刷布线板及半导体装置,该树脂组合物当使用于要求微细布线加工的多层印刷布线板时,具有低热膨胀率,且呈现出较以往更高的耐热性、阻燃性以及优异的绝缘可靠性。本发明的树脂组合物,作为必需成分含有(A)环氧树脂、(B)氰酸酯树脂及(C)鎓盐化合物。


Also published as:
JPWO2010074085US20110255258KR1020110117061MYPI 2011002883WO/2010/074085