Processing

Please wait...

Settings

Settings

Goto Application

1. CN101515541 - Substrate processor and substrate rotation device

Office
China
Application Number 200910126384.0
Application Date 27.10.2005
Publication Number 101515541
Publication Date 26.08.2009
Publication Kind A
IPC
H01L 21/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L 21/324
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
H01L 21/687
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
CPC
H01L 21/67109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
67109mainly by convection
H01L 21/68792
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68792characterised by the construction of the shaft
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
Applicants Tokyo Electron Ltd.
东京毅力科创株式会社
Inventors Tanaka Kiyoshi
田中澄
Suzuki Kimitaka
铃木公贵
Agents long chun
北京尚诚知识产权代理有限公司
Priority Data 2004313919 28.10.2004 JP
Title
(EN) Substrate processor and substrate rotation device
(ZH) 基板处理装置以及基板旋转装置
Abstract
(EN) The present invention provides an improved substrate rotation mechanism and a substrate processor device for greatly reducing the yield of particles. The substrate processor is provided with a processing container 1 dividing a processing space for processing a substrate to be processed W, a substrate supporting body 12 supporting the substrate to be processed W in the processing container, a movable member 11 which is directly or indirectly connected to the substrate supporting body 12, and a rotor 10 rotating the substrate supporting body 12 through the movable member 11 by rotation while it abuts on the movable member 11. The movable member 11 and the rotor 10 are formed of ceramic materials whose values of fracture toughness defined in JIS R1607, and/or whose values of three point flexural strength defined in JIS R1601 differ.
(ZH)

本发明提供一种为了大幅降低颗粒的产生量而进行改良后的基板旋转装置、以及具备该基板旋转装置的基板处理装置。基板处理装置,其特征在于,包括:间隔用于处理基板的处理空间的处理容器;在所述处理容器内支承所述基板的基板支承体;直接或间接地连接在所述基板支承体上、由陶瓷材料形成的从动旋转体;和在所述处理容器内,经由缓冲部件与所述从动旋转体接触,支撑所述从动旋转体并且旋转驱动所述从动旋转体的,由陶瓷材料形成的驱动旋转体。