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1. CN101501599 - Modular computing environments

Office China
Application Number 200680055433.0
Application Date 27.06.2006
Publication Number 101501599
Publication Date 05.08.2009
Grant Number 101501599
Grant Date 21.12.2011
Publication Kind B
IPC
G05D 23/00
GPHYSICS
05CONTROLLING; REGULATING
DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
23Control of temperature
F25B 49/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION OR SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
49Arrangement or mounting of control or safety devices
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H05K 7/202
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20009using a gaseous coolant in electronic enclosures
202Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
G06F 1/20
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
1Details not covered by groups G06F3/00G06F13/00 and G06F21/00
16Constructional details or arrangements
20Cooling means
G06F 2200/201
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
FELECTRIC DIGITAL DATA PROCESSING
2200Indexing scheme relating to G06F1/04 - G06F1/32
20Indexing scheme relating to G06F1/20
201Cooling arrangements using cooling fluid
H05K 7/1497
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
14Mounting supporting structure in casing or on frame or rack
1485Servers; Data center rooms, e.g. 19-inch computer racks
1497Rooms for data centers; Shipping containers therefor
H05K 7/20754
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20754Air circulating in closed loop within cabinets
H05K 7/2079
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20709for server racks or cabinets; for data centers, e.g. 19-inch computer racks
20763Liquid cooling without phase change
2079within rooms for removing heat from cabinets
Applicants Google Inc.
谷歌公司
Inventors Clidaras Jimmy
吉米·克里达拉斯
Whitted William
威廉·维特德
Hamburgen William
威廉·哈姆伯根
Sykora Montgomery
蒙哥马利·西科拉
Leung Winnie
温妮·莱昂
Aigner Gerald
杰拉尔德·艾格纳
Beaty Donald L.
唐纳德·L·比提
Agents zhang huansheng an xiang
中原信达知识产权代理有限责任公司 11219
中原信达知识产权代理有限责任公司 11219
Priority Data 60/810,451 01.06.2006 US
Title
(EN) Modular computing environments
(ZH) 模块化计算环境
Abstract
(EN)
A computer system may include a connecting hub having a plurality of docking regions and be configured to provide to each docking region electrical power, a data network interface, a cooling fluid supply and a cooling fluid return; and a plurality of shipping containers that each enclose a modular computing environment that incrementally adds computing power to the system. Each shipping container may include a) a plurality of processing units coupled to the data network interface, each of which include a microprocessor; b) a heat exchanger configured to remove heat generated by the plurality of processing units by circulating cooling fluid from the supply through the heat exchanger and discharging it into the return; and c) docking members configured to releaseably couple to the connecting hub at one of the docking regions to receive electrical power, connect to the data network interface, and receive and discharge cooling fluid.

(ZH)

一种计算机系统,可以包括:连接中心,所述连接中心具有多个对接区并且被配置来向每一个对接区提供电力、数据网络接口、冷却流体供给管以及冷却流体返回管;以及多个装运集装箱,其每一个都装有向系统递增地添加计算能力的模块化计算环境。每一个装运集装箱可以包括:a)耦接到数据网络接口的多个处理单元,每一个处理单元包括微处理器;b)热交换器,其被配置为通过使冷却流体从供给管流经热交换器以及将冷却流体排入返回管中来将所述多个处理单元产生的热量移除;以及c)对接部件,其被配置为在对接区中的一个处可释放地耦接到连接中心以接收电力、连接到数据网络接口以及接收和排出冷却流体。