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1. (CN101227998) Hybrid laser processing device

Office : China
Application Number: 200680026545.3 Application Date: 11.07.2006
Publication Number: 101227998 Publication Date: 23.07.2008
Publication Kind : A
Prior PCT appl.: Application Number:PCTJP2006313750 ; Publication Number:2007010783 Click to see the data
IPC:
B23K 26/08
B23P 17/00
B23K 26/06
B26F 3/00
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
08
Devices involving relative movement between laser beam and workpiece
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
P
OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
17
Metal-working operations, not covered by a single other subclass or another group in this subclass
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
02
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06
Shaping the laser beam, e.g. by masks or multi-focusing
B PERFORMING OPERATIONS; TRANSPORTING
26
HAND CUTTING TOOLS; CUTTING; SEVERING
F
PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
3
Severing by means other than cutting; Apparatus therefor
CPC:
B23K 26/0643
B23K 26/064
B23K 26/0665
B23K 26/08
B23K 26/146
B23K 26/38
B23K2201/40
B26F 3/004
Applicants: Shibuya Kogyo Co., Ltd.
涩谷工业株式会社
Inventors: Koseki Ryoji
小关良治
Sasaki Motoi
佐佐木基
Kawahara Yoshihiro
河原吉博
Agents: heteng yun
中国国际贸易促进委员会专利商标事务所
Priority Data: 2005210816 21.07.2005 JP
Title: (EN) Hybrid laser processing device
(ZH) 混合激光加工装置
Abstract: front page image
(EN) Laser light L emitted from a laser oscillator (4) is guided by an optical fiber (12), constituting a light guide means (7), up to a processing head (6) having a channel (25) through which high pressure liquid is supplied by a high pressure pump (5). The high pressure liquid is ejected as a liquid column W from an ejection hole (24) of an ejection nozzle (23) provided at the lower end of the processing head (6). The optical fiber is exposed to the interior of the liquid channel and the forward end of a fiber core (12a) of the optical fiber is projected from a fiber clad (12b) and located in the proximity of the ejection hole. Laser light emitted from the fiber core is reflected at a first inclined surface (24a) of the ejection hole and guided to the liquid column, and then a workpiece (2) is processed. The laser light can be easily guided to the liquid column.
(ZH)

本发明的混合激光加工装置(1)易于将激光向液柱导光,由激光起振器(4)起振的激光(L)被构成导光机构(7)的光纤(12)向加工头(6)导光,在加工头上形成由高压泵(5)供给高压液体的液体通路(25),该高压液体从加工头(6)下端设置着的喷射喷嘴(23)的喷射孔(24)形成液柱(W)而喷射。上述光纤露出到上述液体通路的内部,进而光纤的光纤芯(12a)的前端比光纤覆层(12b)更突出而接近上述喷射孔附近。而且,从光纤芯照射的激光被形成在喷射孔上的第一倾斜面(24a)反射之后导入上述液柱,进行被加工物(2)的加工。


Also published as:
KR1020080028434EP1905529US20090045177WO/2007/010783