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1. (CN101218027) Compliant microfluidic sample processing disks

Office : China
Application Number: 200680024739.X Application Date: 30.06.2006
Publication Number: 101218027 Publication Date: 09.07.2008
Grant Number: 101218027 Grant Date: 20.02.2013
Publication Kind : B
Prior PCT appl.: Application Number:PCTUS2006026016 ; Publication Number:2007005853 Click to see the data
IPC:
B01L 3/00
B PERFORMING OPERATIONS; TRANSPORTING
01
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
L
CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
3
Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
CPC:
B01L 3/502715
B01L 3/502738
B01L 7/52
B01L 2200/027
B01L 2200/0689
B01L 2300/044
B01L 2300/0803
B01L 2300/0887
B01L 2300/1805
Applicants: 3M Innovative Properties Co.
3M创新有限公司
Inventors: Bedingham William
威廉姆·拜丁汉姆
Robole Barry W.
巴里·W·罗博莱
Agents: tianjun feng zhengli
中原信达知识产权代理有限责任公司 11219
中原信达知识产权代理有限责任公司 11219
Priority Data: 11174680 05.07.2005 US
Title: (EN) Compliant microfluidic sample processing disks
(ZH) 顺应性微流控试样处理盘
Abstract: front page image
(EN) Microfluidic sample processing disks with a plurality of fluid structures formed therein are disclosed. Each of the fluid structures preferably includes an input well and one or more process chambers connected to the input well by one or more delivery channels. The process chambers may be arranged in a compliant annular processing ring that is adapted to conform to the shape of an underlying thermal transfer surface under pressure. That compliance may be delivered in the disks of the present invention by locating the process chambers in an annular processing ring in which a majority of the volume is occupied by the process chambers. Compliance within the annular processing ring may alternatively be provided by a composite structure within the annular processing ring that includes covers attached to a body using pressure sensitive adhesive.
(ZH)

公开了其中形成有多个流体结构的微流控试样处理盘。每个所述流体结构优选地包括注入槽(20)和一个或多个处理室(30),所述处理室通过一个或多个输送通道(42,44,46)连接至所述注入槽(20)。所述处理室(30)可被布置在顺应性环形处理圈中,所述顺应性环形处理圈适合于符合压力作用下的下面的热传递表面的形状。这种顺应性通过将处理室设置在大部分容积都被处理室占据的环形处理圈中而可以在本发明的试样处理盘中传递。或者,环形处理圈中的顺应性可以通过该环形处理圈中的复合结构提供,其中所述环形处理圈包括使用压敏粘合剂而联接至本体的盖子。


Also published as:
MXMX/a/2008/000264KR1020080027327EP1899063ZA2008/01183JP2009500626CA2614253
AU2006265087IN27/CHENP/2008WO/2007/005853