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1. CN101213890 - Multilayer circuit board and manufacturing method thereof

Office China
Application Number 200680024212.7
Application Date 17.04.2006
Publication Number 101213890
Publication Date 02.07.2008
Grant Number 101213890
Grant Date 01.02.2012
Publication Kind B
IPC
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
46
Manufacturing multi-layer circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23
Details of semiconductor or other solid state devices
12
Mountings, e.g. non-detachable insulating substrates
H05K 3/46
H01L 23/12
CPC
H05K 1/0265
H01L 23/15
H01L 23/49822
H01L 23/49827
H01L 23/49838
H01L 2224/16
Applicants Murata Manufacturing Co.
株式会社村田制作所
Inventors Oikawa Yoshikazu
及川善和
Yoshikawa Takayoshi
吉川孝义
Agents zhangxin
上海专利商标事务所有限公司 31100
Priority Data 203443/2005 12.07.2005 JP
Title
(EN) Multilayer circuit board and manufacturing method thereof
(ZH) 多层布线基板及其制造方法
Abstract
(EN)
In conventional technology, since a line conductor or a via-hole conductor has a connection land, when a ceramic board is fabricated, the connection land can prevent connection failures caused by a misalignment between the via-hole conductor and the line conductor, fabrication errors thereof, etc. However, as shown in view. 8(a), for example, a connection land (3) protrudes from a via-hole conductor (2) toward an adjacent via-hole conductor (2), which restricts the reduction of the gap between the via-hole conductors (2). Multilayer wiring board (10) comprises a multilayer body (11) formed by stacking a plurality of ceramic layers (11A) and a wiring pattern (12) provided within the multilayer body (11). The ceramic layer (11A) includes as the wiring pattern (12), a through via-hole conductor (16) vertically passing through the ceramic layer (11A) and a semi-through via-hole conductor (16A) electrically connected to the through via-hole conductor (16) within the same ceramic layer (11A) and not passing through the ceramic layer (11A).

(ZH)

虽然在过去技术的情况下,因为线路导体或者通路孔导体具有连接盘,所以在制造陶瓷基板时利用连接盘能够防止由于通路孔导体与线路导体之间的位置偏移及各自的加工误差等而引起的连接不良,但是如图所示,因为连接盘(3)从通路孔导体(2)向相邻的通路孔导体(2)伸出,所以由此会妨碍通路孔导体(2)之间的狭小间距化。本发明的多层布线基板(10)具有:层叠多个陶瓷层(11A)而组成的层叠体(11)、以及设置在层叠体(11)内的布线图形(12),在陶瓷层(11A)中,作为布线图形(12)具有:上下穿通陶瓷层(11A)的穿通通路孔导体(16);以及与穿通通路孔导体(16)在同一陶瓷层(11A)内电连接、且不穿通该陶瓷层(11A)的半穿通连续通路孔导体(16A)。

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