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1. (CN101213491) Photosensitive resin composition and adhesion enhancer

Office : China
Application Number: 200680024028.2 Application Date: 18.04.2006
Publication Number: 101213491 Publication Date: 02.07.2008
Grant Number: 101213491 Grant Date: 14.09.2011
Publication Kind : B
Prior PCT appl.: Application Number:PCTJP2006308093 ; Publication Number:2007004345 Click to see the data
IPC:
G03F 7/085
G03F 7/075
C08K 5/544
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
085
Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
G PHYSICS
03
PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
004
Photosensitive materials
075
Silicon-containing compounds
C CHEMISTRY; METALLURGY
08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
K
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS
5
Use of organic ingredients
54
Silicon-containing compounds
544
containing nitrogen
CPC:
G03F 7/0751
C08K 5/0025
C08K 5/544
G03F 7/0045
G03F 7/0226
G03F 7/0755
Y10S 430/106
Y10S 430/111
Y10S 430/115
Y10S 430/117
Applicants: Toray Industries
东丽株式会社
Inventors: Yuba Tomoyuki
弓场智之
Fujita Yoji
藤田阳二
Tomikawa Masao
富川真佐夫
Agents: xiongyu lan libeng yang
中国专利代理(香港)有限公司 72001
中国专利代理(香港)有限公司 72001
Priority Data: 191346/2005 30.06.2005 JP
Title: (EN) Photosensitive resin composition and adhesion enhancer
(ZH) 感光性树脂组合物及粘合改良剂
Abstract:
(EN) A photosensitive resin composition comprising alkali soluble resin (a), silicon compound (b) having secondary aromatic amino and alkoxyl and at least one member (c) selected from among a photopolymerization initiator, a photoacid generator and a photobase generator. Thus, there can be obtained a photosensitive resin composition that without detriment to the storage stability of solution, strikingly enhances the adhesion with substrate after curing and even at development, is free from micropattern peeling.
(ZH)

本发明的感光性树脂组合物,其含有(a)碱可溶性树脂、(b)具有芳香族仲氨基和烷氧基的硅化合物、以及(c)选自光聚合引发剂、光酸发生剂和光碱发生剂中的至少1种。根据本发明,可以得到不损害溶液的保存稳定性、显著提高固化后的与基板的粘合性的同时,显影时不剥离微细图案的感光性树脂组合物。


Also published as:
KR1020080028464EP1909142JPWO2007004345US20090123867JP5087923WO/2007/004345