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1. CN101167168 - Substrate processing platform allowing processing in different ambients

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China
Application Number 200680013927.2
Application Date 14.04.2006
Publication Number 101167168
Publication Date 23.04.2008
Publication Kind A
IPC
H01L 21/332
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
328Multistep processes for the manufacture of devices of the bipolar type, e.g. diodes, transistors, thyristors
33the devices comprising three or more electrodes
332Thyristors
CPC
H01L 21/67115
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
67115mainly by radiation
H01L 21/67207
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67155Apparatus for manufacturing or treating in a plurality of work-stations
67207comprising a chamber adapted to a particular process
H01L 21/67778
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
677for conveying, e.g. between different workstations
67763the wafers being stored in a carrier, involving loading and unloading
67778involving loading and unloading of waers
H01L 21/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Applicants Applied Materials Inc.
应用材料公司
Inventors Yokota Yoshitaka
横田好隆
Moritz Kirk
克尔克·莫里茨
Ma Kai
马楷
Chang Wen
温·常
Parasiris Anastansios
安娜斯塔西亚丝·帕拉希瑞丝
Sharma Rohit
鲁希特·夏尔玛
Tjandra Agus
阿古斯·钱德拉
Achutharaman Vendapuram
梵达普拉姆·阿舒塔拉曼
Ramamurthy Sundar
孙达拉·拉马穆尔蒂
Thakur Randhir
兰迪尔·塔库尔
Agents zhaofei
北京东方亿思知识产权代理有限责任公司
Priority Data 11114250 25.04.2005 US
Title
(EN) Substrate processing platform allowing processing in different ambients
(ZH) 允许在不同环境下进行处理的衬底处理平台
front page image
Abstract
(EN) A semiconductor wafer processing system (40) including a factory interface (26) operating at atmospheric pressure and mounting plural wafer cassettes and further including plural wafer processing chambers (42, 44) mounted on a frame (16) and connected to the factory interface through respective slit valves. A robot in the factory interface can transfer wafers (32) between the cassettes and the processing chambers. At least one of the processing chambers can operate at reduced pressure and is pumped by a vacuum pump (46) mounted on the frame. The processing chamber may be a rapid thermal processing chamber (52) including an array of lamps (66) irradiating a processing volume (100) through a window (60). The lamphead is vacuum pumped to a pressure approximating that in the processing volume. A multi-step process may be performed with different pressures. The invention also includes a wafer access port (202) of a thermal processing chamber which can flow (210) an inert gas in outside of the slit valve to thereby form a gas curtain outside of the opened slit (206) to prevent the out flow of toxic processing gases.
(ZH)

一种半导体晶片处理系统(40)包括工厂接口(26)，其在大气压力下工作，能够安装多个衬底盒子，其还包括安装在框架(16)上并通过相应缝隙阀连接到工厂接口的多个衬底处理室(42、44)。工厂接口中的机械手能够在盒子和处理室之间传送晶片(32)。处理室中至少一者能够在低压下工作，并由安装在框架上的真空泵(46)抽吸。处理室可以是灯(66)阵列的快速热处理室(52)，灯(66)通过窗(60)照射处理空间(100)。灯头真空抽吸至接近处理空间的压力。多步骤处理可以用不同的压力来进行。本发明还包括热处理室的晶片存取端口(202)，其能够在缝隙阀的外部使惰性气体流入(210)，由此在打开的缝隙(206)外部形成气体板，以防止毒性处理气体流出。
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