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1. CN101107678 - Conductive paste

Office
China
Application Number 200680002636.3
Application Date 20.01.2006
Publication Number 101107678
Publication Date 16.01.2008
Grant Number 101107678
Grant Date 07.03.2012
Publication Kind B
IPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/09
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 3/4069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
4038Through-connections; Vertical interconnect access [VIA] connections
4053by thick-film techniques
4069for via connections in organic insulating substrates
Applicants Fujikura Kasei KK
藤仓化成株式会社
旭化成电子材料株式会社
Inventors Hirakawa Yohei
平川洋平
Wakabayashi Katsutomo
若林克知
Yotsuyanagi Yuta
四柳雄太
Tanaka Norihito
田中轨人
Agents xujiang hua wangzhen xian
北京德琦知识产权代理有限公司 11018
北京德琦知识产权代理有限公司 11018
Priority Data 016965/2005 25.01.2005 JP
Title
(EN) Conductive paste
(ZH) 导电浆料
Abstract
(EN)
A conductive paste having an excellent conductivity and an excellent conductive connection reliability contains a binder containing a thermosetting resin, and conductive particles. The lowest heat generation peak temperature T1 (degrees C) among at least one heat generation peak obtained by a differential scanning calorie measurement of the binder and the lowest heat absorption peak temperature t1 (degrees C) among at least one heat absorption peak obtained by the differential scanning calorie measurement of the conductive particles satisfy the following relationship: t1 - 20 < T1(1).

(ZH)

本发明提供了一种导电浆料,该导电浆料包括含有热固性树脂的粘合剂和导电粒子,所述粘合剂的差示扫描量热法测定的至少一个放热峰中最低放热峰温度T1(℃)和所述导电粒子的差示扫描量热法测定的至少一个吸热峰中最低吸热峰温度t1(℃)满足t1-20<T1......(1)关系。该导电浆料的导电性良好,而且导电连接可靠性也优良。