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1. CN101010792 - Substrate treating device and substrate rotating device

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Office
China
Application Number 200580028801.8
Application Date 27.10.2005
Publication Number 101010792
Publication Date 01.08.2007
Grant Number 100527379
Grant Date 12.08.2009
Publication Kind C
IPC
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
H01L 21/67109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
67109mainly by convection
H01L 21/68792
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68792characterised by the construction of the shaft
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
Applicants Tokyo Electron Ltd.
东京毅力科创株式会社
Inventors Tanaka Sumi
田中澄
Suzuki Kouki
铃木公贵
Agents longchun
北京尚诚知识产权代理有限公司
Priority Data 2004313919 28.10.2004 JP
Title
(EN) Substrate treating device and substrate rotating device
(ZH) 基板处理装置以及基板旋转装置
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Abstract
(EN) The invention provides an improved substrate rotating device for reducing the amount of particles and a substrate treating device having the substrate rotating device. The substrate rotating device comprises a rotatablely driven body directly or indirectly connected to substrate supporting bodies, for example a driven ring; a rotatablely driving body rotatablely driving the rotatablely driven body by rotating in the state of coming into contact with the rotatablely driven body, for example a driving rotator. The rotatablely driven body and the rotatablely driving body are formed of a ceramics material with JIS R1607 standard of destruction toughness value and/or JIS R1601 standard for three-point bending strength value.
(ZH)

本发明提供一种为了大幅降低颗粒的产生量而进行改良后的基板旋转装置、以及具备该基板旋转装置的基板处理装置。基板旋转装置包括：直接或者间接地连接在基板支承体上的从动旋转体、例如从动环；和在与可动部件接触的状态下，进行旋转从而旋转驱动上述从动旋转体的驱动旋转体、例如，驱动转子。从动旋转体和驱动旋转体，由JIS R1607标准规定的破坏韧性的值以及/或者JIS R1601标准规定的三点弯曲强度的值不同的陶瓷材料构成。
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