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1. CN1957222 - Multiple evaporator heat pipe assisted heat sink

Office China
Application Number 200580016359.7
Application Date 07.04.2005
Publication Number 1957222
Publication Date 02.05.2007
Publication Kind A
IPC
F28F 7/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
7Elements not covered by group F28F1/, F28F3/, or F28F5/121
F28D 15/00
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
CPC
F28D 15/0233
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0233the conduits having a particular shape, e.g. non-circular cross-section, annular
F28D 15/0266
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0266with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
F28D 15/0275
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
F28D 2021/0029
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
21Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
0028for cooling heat generating elements, e.g. for cooling electronic components or electric devices
0029Heat sinks
F28F 3/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
3Plate-like or laminated elements; Assemblies of plate-like or laminated elements
02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
Applicants Aavid Thermalloy LLC
阿威德热合金有限公司
Inventors Whitney Bradley R.
布拉德利·R·惠特尼
Agents wangxin hua
中科专利商标代理有限责任公司
Priority Data 60/560,869 09.04.2004 US
Title
(EN) Multiple evaporator heat pipe assisted heat sink
(ZH) 多蒸发器热管辅助的散热器
Abstract
(EN)
A heat sink includes a base plate which is fitted against a component to be cooled, and a heat pipe formed as a loop having a condenser portion upstanding from the base plate and a pair of ends which form a pair of evaporator portions received in parallel channels in the base plate. A wall upstanding from the base plate between the channels is formed with an upright channel which receives the condenser portion substantially within the profile of the wall, so that a plurality of horizontal cooling fins can be fixed to the wall in thermal contact with the condenser portion.

(ZH)

一种散热器,包括:抵靠要冷却的元件装配的基板;以及形成为回路的热管,所述回路具有从基板竖起的冷凝器部分、以及形成容纳在基板中的平行通道内的一对蒸发器部分的一对端部。在通道之间从基板竖起的壁部形成有使冷凝器部分大体容纳在壁部的轮廓内的竖直通道,使得多个水平散热片可以被固定到与冷凝器部分热接触的壁部。