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1. (CN1254493) Method of attaching metallic objects to printed circuit board

Office : China
Application Number: 98804692.X Application Date: 02.03.1998
Publication Number: 1254493 Publication Date: 24.05.2000
Publication Kind : A
Prior PCT appl.: Application Number:PCTUS9804013 ; Publication Number:9849875 Click to see the data
IPC:
H05K 3/36
H05K 1/14
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3
Apparatus or processes for manufacturing printed circuits
36
Assembling printed circuits with other printed circuits
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
14
Structural association of two or more printed circuits
CPC:
H05K 3/341
H05K 3/0061
H05K 3/3452
H05K 3/3484
H05K 2201/09063
H05K 2203/042
Y02P 70/613
Applicants: Motorola Inc.
摩托罗拉公司
Inventors: Patrick Masterton
帕特里克·马斯特顿
Agents: wang sibeng
中国国际贸易促进委员会专利商标事务所
Priority Data: 08/846,361 30.04.1997 US
Title: (EN) Method of attaching metallic objects to printed circuit board
(ZH) 将金属件固定到印刷电路板上的方法
Abstract: front page image
(EN) A single-step heating application for soldering a metallic flange (202) and other components (309) to a printed circuit board (201) is disclosed. Printed circuit board (201) includes one or more through apertures (203) where a solder paste (305) is dispensed, and is heated with metallic flange (202) and other components (309). The apertures (203) holding solder paste (305) have walls of non-metallic surfaces where solder is repelled during the heating process such that the solder flows to an area where the surfaces of metallic flange (202) and printed circuit board (201) are being soldered.
(ZH)

公开了一种单步骤加热方法,用于将金属凸缘(202)及其它部件(309)固定到印刷电路板(201)上。印刷电路板(201)包含一个或多个分置了焊接浆料(305)的贯通孔(203),该孔(203)与金属凸缘(202)及其它部件(309)一起被加热。装有焊接浆料(305)的孔(203)的壁具有非金属表面,从而使焊接浆料在加热时被排出,由此焊料流入金属凸缘(202)和印刷电路板(201)的待固定表面之间的区域。


Also published as:
JP2001522532 WO/1998/049875