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1. CN113937236 - Display substrate, preparation method thereof, and display device

Office
China
Application Number 202010615474.2
Application Date 29.06.2020
Publication Number 113937236
Publication Date 14.01.2022
Publication Kind A
IPC
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
52Details of devices
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes (OLED) or polymer light emitting devices (PLED)
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes
CPC
H01L 51/5237
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
5237Passivation; Containers; Encapsulation, e.g. against humidity
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
H01L 27/3244
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
3241Matrix-type displays
3244Active matrix displays
H01L 2227/323
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2227Indexing scheme for devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate covered by group H01L27/00
32Devices including an organic light emitting device [OLED], e.g. OLED display
323Multistep processes for AMOLED
H01L 27/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
28including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
32with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
H01L 51/52
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
52Details of devices
Applicants BOE TECHNOLOGY GROUP CO., LTD.
京东方科技集团股份有限公司
CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
成都京东方光电科技有限公司
Inventors SHANG TINGHUA
尚庭华
QING HAIGANG
青海刚
YANG LULU
杨路路
LUO ZHENGWEI
罗正位
Agents 北京安信方达知识产权代理有限公司 11262
北京安信方达知识产权代理有限公司 11262
Title
(EN) Display substrate, preparation method thereof, and display device
(ZH) 显示基板及其制备方法、显示装置
Abstract
(EN) A display substrate comprises a substrate body, a power line, an organic insulating layer and a metal protection structure. The substrate comprises a display area, a binding area located on one side of the display area and a first peripheral area located between the display area and the binding area. The display area includes a plurality of display units. The power line is arranged in the first peripheral area of the substrate and electrically connected with the display unit. The organic insulating layer is arranged on the side, away from the substrate, of the power line. The organic insulating layer comprises at least two organic grooves in the first peripheral area and an isolation dam arranged between every two adjacent organic grooves, and the organic grooves penetrate through the organic insulating layer. Orthographic projections of the power lines and the organic grooves on the substrate have an overlapping area. The metal protection structure is arranged on the side, away from the substrate, of the power line and covers at least one edge, intersecting with the first direction, of the overlapping area of the power line. The first direction is parallel to the extension direction of the edge, close to one side of the first peripheral area, of the display area.
(ZH) 一种显示基板,包括:衬底基板、电源线、有机绝缘层和金属保护结构。衬底基板包括显示区域、位于显示区域一侧的绑定区域以及位于显示区域和绑定区域之间的第一周边区域。显示区域包括多个显示单元。电源线设置在衬底基板的第一周边区域,且与显示单元电连接。有机绝缘层设置在电源线远离衬底基板的一侧。有机绝缘层在第一周边区域包括至少两个有机槽,以及设置在相邻的两个有机槽之间的隔离坝,有机槽贯穿有机绝缘层。电源线与有机槽在衬底基板上的正投影具有重叠区域。金属保护结构设置在电源线远离衬底基板的一侧,且覆盖电源线的重叠区域与第一方向交叉的至少一个边缘。第一方向为平行于显示区域靠近第一周边区域一侧的边缘的延伸方向。
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