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1. CN111403334 - Integrated structure of crystal resonator and control circuit and integration method thereof

Office China
Application Number 201811647856.2
Application Date 29.12.2018
Publication Number 111403334
Publication Date 10.07.2020
Publication Kind A
IPC
H01L 21/77
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
H01L 27/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
20including piezo-electric components; including electrostrictive components; including magnetostrictive components
CPC
H01L 21/77
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
H01L 27/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
20including piezo-electric components; including electrostrictive components; including magnetostrictive components
H03H 9/02
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
02Details
H03H 9/17
HELECTRICITY
03BASIC ELECTRONIC CIRCUITRY
HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
15Constructional features of resonators consisting of piezo-electric or electrostrictive material
17having a single resonator
Applicants SHANGHAI BRANCH OF NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
中芯集成电路(宁波)有限公司上海分公司
Inventors QIN XIAOSHAN
秦晓珊
Agents 上海思微知识产权代理事务所(普通合伙) 31237
Title
(EN) Integrated structure of crystal resonator and control circuit and integration method thereof
(ZH) 晶体谐振器与控制电路的集成结构及其集成方法
Abstract
(EN)
The invention provides an integrated structure of a crystal resonator and a control circuit and an integration method thereof. A lower cavity is formed in a device wafer, and an upper cavity is formedin a substrate; the device wafer and the substrate are bonded by using a bonding process, so that a piezoelectric resonance sheet is clamped between the device wafer and the substrate, the lower cavity and the upper cavity are enabled to respectively correspond to two sides of the piezoelectric resonance sheet to form the crystal resonator, and the crystal resonator is enabled to be electricallyconnected with the control circuit, so the integrated arrangement of the crystal resonator and the control circuit can be realized. Compared with a traditional crystal resonator, the crystal resonatorhas the advantages that the size is smaller, the power consumption of the crystal resonator can be reduced, the crystal resonator can be integrated with other semiconductor components more easily, and therefore the integration degree of the device can be improved.

(ZH)
本发明提供了一种晶体谐振器与控制电路的集成结构及其集成方法。通过在器件晶圆中形成下空腔以及在基板中形成上空腔,并利用键合工艺使器件晶圆和基板键合,以将压电谐振片夹持在器件晶圆和基板之间,并使下空腔和上空腔分别对应在压电谐振片的两侧以构成晶体谐振器,同时还使晶体谐振器电连接控制电路,实现了晶体谐振器和控制电路的集成设置。相比于传统的晶体谐振器,本发明中的晶体谐振器具备更小的尺寸,有利于降低晶体谐振器的功耗,并且本发明中的晶体谐振器更也易于与其他半导体元器件集成,从而能够提高器件的集成度。

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