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1. CN111384017 - Flip chip assembly, flip chip packaging structure and preparation method

Office
China
Application Number 201811638810.4
Application Date 29.12.2018
Publication Number 111384017
Publication Date 07.07.2020
Publication Kind A
IPC
H01L 23/488
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
CPC
H01L 23/488
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
Applicants CHIPMORE TECHNOLOGY CORPORATION LIMITED
颀中科技(苏州)有限公司
Inventors MEI YAN
梅嬿
Agents 苏州威世朋知识产权代理事务所(普通合伙) 32235
Title
(EN) Flip chip assembly, flip chip packaging structure and preparation method
(ZH) 倒装芯片组件、倒装芯片封装结构及制备方法
Abstract
(EN)
The invention provides a flip chip assembly, a flip chip packaging structure and a preparation method. The flip chip assembly comprises a chip, a first conductive column and a second conductive column, wherein the first conductive column and the second conductive column are formed on the surface of one side of the chip in the first direction, the second conductive column is larger than the first conductive column, and a first solder block is arranged at the end, away from the chip, of the first conductive column. A plurality of second solder blocks are arranged at the end, away from the chip,of the second conductive column at intervals. A conductive base is further arranged between the second solder blocks and the second conductive column. The preparation method of the flip chip assemblycomprises the following steps: preparing a plurality of conductive bases which are arranged at intervals on a second conductive column, preparing corresponding second solder blocks on the conductive bases, and converting the first solder blocks and the second solder blocks from an initial state to a finished product state through heat treatment. According to the invention, solder structures on strip-shaped, elliptical and other second conductive columns with large sizes are adjusted, and the product quality is improved.

(ZH)
本发明提供了一种倒装芯片组件、倒装芯片封装结构及制备方法,所述倒装芯片组件包括芯片、沿第一方向形成在所述芯片一侧表面的第一导电柱与第二导电柱,所述第二导电柱大于第一导电柱,所述第一导电柱背离所述芯片的一端设有第一焊料块;所述第二导电柱背离所述芯片的一端设置有若干相互间隔的第二焊料块,且所述第二焊料块与第二导电柱之间还设有的导电底座。所述倒装芯片组件的制备方法包括在第二导电柱上制得若干相互间隔的导电底座,再于导电底座上制得相应的第二焊料块,再通过热处理使得第一焊料块及第二焊料块由初始状态转换至成品状态。本发明针对条状、椭圆状等具有较大尺寸的第二导电柱上的焊料结构进行调整,提高产品质量。

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