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1. CN111244039 - 密封结构及其制作方法和显示装置

Office China
Application Number 201811441329.6
Application Date 29.11.2018
Publication Number 111244039
Publication Date 05.06.2020
Publication Kind A
IPC
H01L 23/29
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
29characterised by the material
H01L 23/31
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulation, e.g. encapsulating layers, coatings
31characterised by the arrangement
H01L 21/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
56Encapsulations, e.g. encapsulating layers, coatings
Applicants 合肥鑫晟光电科技有限公司
京东方科技集团股份有限公司
Inventors 马涛
罗标
何为
杨成绍
Agents 北京市柳沈律师事务所 11105
北京市柳沈律师事务所 11105
Title
(ZH) 密封结构及其制作方法和显示装置
Abstract
(ZH)
一种密封结构及其制作方法和显示装置,该密封结构包括:衬底基板;位于衬底基板上的密封胶;以及位于衬底基板和密封胶之间且与密封胶接触的接触层。在该密封结构中,接触层的远离衬底基板的接触层表面在与密封胶接触的接触位置处是非平坦的。该密封结构具有较好的阻隔水汽的能力。

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