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1. CN111244010 - 一种LED芯片、显示面板的组装设备及组装方法

Office China
Application Number 201811446284.1
Application Date 29.11.2018
Publication Number 111244010
Publication Date 05.06.2020
Publication Kind A
IPC
H01L 21/683
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
H01L 33/00
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
Applicants 昆山工研院新型平板显示技术中心有限公司
昆山国显光电有限公司
Inventors 郭双
田文亚
Agents 广东君龙律师事务所 44470
Title
(ZH) 一种LED芯片、显示面板的组装设备及组装方法
Abstract
(ZH)
本申请公开了一种LED芯片、显示面板的组装设备及组装方法,所述LED芯片包括芯片主体以及设置于所述芯片主体上的磁性件,其中,所述磁性件设置成允许在外部转移装置所产生的磁性吸附力的作用下吸附所述LED芯片。通过上述方式,本申请能够提高显示面板组装的效率。

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